Angular thickness distribution and target utilization for hot Ni target magnetron sputtering; Vacuum; Vol. 160

Angular thickness distribution and target utilization for hot Ni target magnetron sputtering; Vacuum; Vol. 160

Chi tiết về thư mục
Parent link:	Vacuum Vol. 160.— 2018.— [P. 418-420]
Tác giả chính:	Sidelev D. V. Dmitry Vladimirovich
Tác giả của công ty:	Национальный исследовательский Томский политехнический университет Инженерная школа ядерных технологий Научно-образовательный центр Б. П. Вейнберга
Tác giả khác:	Krivobokov V. P. Valery Pavlovich
Tóm tắt:	Title screen This paper reports on the effect of the type of Ni target (hot or cooled) on the angular thickness distribution, deposition rate and target utilization (K) for magnetron sputtering. Here it is shown that a change of magnetic field distribution does not influence on the mass of the deposited material. The Ni films will have a more uniform thickness, when films are obtained by hot target sputtering. The target utilization is higher for magnetron with hot target. This suggests a new approach to increase of K for the sputtering of magnetic targets. Режим доступа: по договору с организацией-держателем ресурса
Ngôn ngữ:	Tiếng Anh
Được phát hành:	2018
Những chủ đề:	электронный ресурс труды учёных ТПУ магнетронные распылительные системы мишень угловое распределение толщина
Truy cập trực tuyến:	https://doi.org/10.1016/j.vacuum.2018.12.001
Định dạng:	Điện tử Chương của sách
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=658897

Internet

https://doi.org/10.1016/j.vacuum.2018.12.001