Angular thickness distribution and target utilization for hot Ni target magnetron sputtering

Bibliographic Details
Parent link:Vacuum
Vol. 160.— 2018.— [P. 418-420]
Main Author: Sidelev D. V. Dmitry Vladimirovich
Corporate Author: Национальный исследовательский Томский политехнический университет Инженерная школа ядерных технологий Научно-образовательный центр Б. П. Вейнберга
Other Authors: Krivobokov V. P. Valery Pavlovich
Summary:Title screen
This paper reports on the effect of the type of Ni target (hot or cooled) on the angular thickness distribution, deposition rate and target utilization (K) for magnetron sputtering. Here it is shown that a change of magnetic field distribution does not influence on the mass of the deposited material. The Ni films will have a more uniform thickness, when films are obtained by hot target sputtering. The target utilization is higher for magnetron with hot target. This suggests a new approach to increase of K for the sputtering of magnetic targets.
Режим доступа: по договору с организацией-держателем ресурса
Published: 2018
Subjects:
Online Access:https://doi.org/10.1016/j.vacuum.2018.12.001
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=658897
Description
Summary:Title screen
This paper reports on the effect of the type of Ni target (hot or cooled) on the angular thickness distribution, deposition rate and target utilization (K) for magnetron sputtering. Here it is shown that a change of magnetic field distribution does not influence on the mass of the deposited material. The Ni films will have a more uniform thickness, when films are obtained by hot target sputtering. The target utilization is higher for magnetron with hot target. This suggests a new approach to increase of K for the sputtering of magnetic targets.
Режим доступа: по договору с организацией-держателем ресурса
DOI:10.1016/j.vacuum.2018.12.001