Natural Oxidation of Ultra-Thin Copper Films

ग्रंथसूची विवरण
Parent link:Russian Physics Journal
Vol. 60, iss. 9.— 2018.— [P. 1559-1564]
निगमित लेखकों: Национальный исследовательский Томский политехнический университет Инженерная школа ядерных технологий Научно-образовательный центр Б. П. Вейнберга, Национальный исследовательский Томский политехнический университет (ТПУ) Инженерная школа новых производственных технологий (ИШНПТ) Отделение материаловедения (ОМ)
अन्य लेखक: Semenov V. A. Vyacheslav Arkadjevich, Oskirko V. O. Vladimir Olegovich, Rabotkin S. V. Sergey Viktorovich, Oskomov K. V. Konstantin Vladimirovich, Soloviev A. A. Andrey Aleksandrovich, Stepanov S. A. Sergey Aleksandrovich
सारांश:Title screen
The paper examines the oxidation of polycrystalline Cu films under the impact of ambient atmosphere in the course of extended time (from 20 to 90 days). It shows that in the case of 10 nm thick Cu films deposited onto the glass substrate by method of magnetron sputtering, one eventually observes the increase in transparency, surface resistance and surface roughness, as well as the decrease in reflection in the area of near infrared region. The most dramatic changes occur in films deposited in the pulse mode of sputtering with frequency of 3 kHz compared to films deposited in the direct current mode. Formation of sublayer ZnO:Al and 20 nm thick upper passivating layer ZnO:Al allows effectively preventing the oxidation of thin copper films under the impact of ambient atmosphere.
Режим доступа: по договору с организацией-держателем ресурса
भाषा:अंग्रेज़ी
प्रकाशित: 2018
विषय:
ऑनलाइन पहुंच:https://doi.org/10.1007/s11182-018-1251-7
स्वरूप: इलेक्ट्रोनिक पुस्तक अध्याय
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=657751

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