Dependence of Some Physical Characteristics of Epoxy Compounds on the Filler Parameters

Bibliografiske detaljer
Parent link:Russian Physics Journal.— , 1965-
Vol. 59, iss. 5.— 2016.— [P. 729-735]
Hovedforfatter: Kim S. V. Sergey Vladimirovich
Institution som forfatter: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электрических сетей и электротехники (ЭСиЭ)
Andre forfattere: Ushakov V. Ya. Vasily Yakovlevich
Summary:Title screen
The effect of the dispersion and thermophysical properties of the filler on the characteristics and aging of the UP5-162 epoxy compound is investigated. It is shown that the particle size and homogeneity of filler distribution affect significantly the internal mechanical stresses during compound curing. Thermal aging of the compound and resistance to thermal stresses are significantly influenced by the thermal conductivity and heat capacity of filler particles. The necessary condition of high mechanical properties and resistance to thermal aging of the compound is a narrow dispersion of filler particles.
Режим доступа: по договору с организацией-держателем ресурса
Udgivet: 2016
Fag:
Online adgang:https://doi.org/10.1007/s11182-016-0828-2
Format: Electronisk Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=656961

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