Flexible hard Al-Si-N films for high temperature operation; Surface and Coatings Technology; Vol. 307, pt. B: Electrochemical and Plasma Electrolytic Modification of Metal Surfaces

Bibliographische Detailangaben
Parent link:Surface and Coatings Technology
Vol. 307, pt. B: Electrochemical and Plasma Electrolytic Modification of Metal Surfaces.— 2016.— [P. 1274-1283]
Körperschaft: Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Лаборатория № 1
Weitere Verfasser: Musil Y. Yindrikh, Remnev (Remnyov) G. E. Gennady Efimovich, Legostaev V. N. Viktor Nikiforovich, Uglov V. V. Vladimir Vasilievich, Lebedinsky A. M. Aleksey Mikhaylovich, Lauk A. L. Aleksandr Lukyanovich, Prochazka J ., Haviar S., Smolyanskiy (Smolyansky, Smolyanskii) E. A. Egor Aleksandrovich
Zusammenfassung:Title screen
This article reports on flexible hard Al-Si-N films prepared by reactive magnetron sputtering. The structure andmechanical properties of Al-Si-N films were controlled by the content of Si in the film, partial pressure of nitrogenpN2 used in sputtering and the power delivered to the magnetron. The Al-Si-N films with a low (?10 at.%) Si contentand with a high (?20 at.%) Si content were prepared. Correlations between the structure, microstructure,mechanical properties and their thermal stability of the Al-Si-N films are analyzed in detail. Thermal stabilityof Al-Si-N films was assessed by thermal annealing in air and water vapor up to annealing temperature Ta =1200 °C. It is shown that (1) the increase of Si content in the Al-Si-N film leads to the change of its crystallinestructure from polycrystalline to X-ray amorphous and (2) the flexible hard Al-Si-N films with high (i) hardnessH ? 20 GPa, (ii) ratio H/E? ? 0.1, and (iii) elastic recovery We ? 60% exhibit enhanced resistance to cracking and(3) the thermal stability of Al-Si-N films with a high (?20 at.%) Si content achieves up to Ta ? 1200 °C in air andup to Ta ? 800 °C in water vapor; here the effective Young's modulus E? = E / (1 ? ?2), E is the Young's modulusand ? is the Poisson's ratio. Conditions under which the flexible hard Al-Si-N films with enhanced resistance tocracking and high thermal stability can be prepared are described in detail.
Режим доступа: по договору с организацией-держателем ресурса
Sprache:Englisch
Veröffentlicht: 2016
Schlagworte:
Online-Zugang:http://dx.doi.org/10.1016/j.surfcoat.2016.05.054
Format: Elektronisch Buchkapitel
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=655564

MARC

LEADER 00000naa0a2200000 4500
001 655564
005 20250913133456.0
035 |a (RuTPU)RU\TPU\network\21766 
035 |a RU\TPU\network\17786 
090 |a 655564 
100 |a 20170912d2016 k||y0rusy50 ba 
101 0 |a eng 
135 |a drcn ---uucaa 
181 0 |a i  
182 0 |a b 
200 1 |a Flexible hard Al-Si-N films for high temperature operation  |f Y. Musil, G. E. Remnev, V. N. Legostaev [et al.] 
203 |a Text  |c electronic 
300 |a Title screen 
320 |a [References: p. 1118 (53 tit.)] 
330 |a This article reports on flexible hard Al-Si-N films prepared by reactive magnetron sputtering. The structure andmechanical properties of Al-Si-N films were controlled by the content of Si in the film, partial pressure of nitrogenpN2 used in sputtering and the power delivered to the magnetron. The Al-Si-N films with a low (?10 at.%) Si contentand with a high (?20 at.%) Si content were prepared. Correlations between the structure, microstructure,mechanical properties and their thermal stability of the Al-Si-N films are analyzed in detail. Thermal stabilityof Al-Si-N films was assessed by thermal annealing in air and water vapor up to annealing temperature Ta =1200 °C. It is shown that (1) the increase of Si content in the Al-Si-N film leads to the change of its crystallinestructure from polycrystalline to X-ray amorphous and (2) the flexible hard Al-Si-N films with high (i) hardnessH ? 20 GPa, (ii) ratio H/E? ? 0.1, and (iii) elastic recovery We ? 60% exhibit enhanced resistance to cracking and(3) the thermal stability of Al-Si-N films with a high (?20 at.%) Si content achieves up to Ta ? 1200 °C in air andup to Ta ? 800 °C in water vapor; here the effective Young's modulus E? = E / (1 ? ?2), E is the Young's modulusand ? is the Poisson's ratio. Conditions under which the flexible hard Al-Si-N films with enhanced resistance tocracking and high thermal stability can be prepared are described in detail. 
333 |a Режим доступа: по договору с организацией-держателем ресурса 
461 1 |t Surface and Coatings Technology 
463 1 |t Vol. 307, pt. B: Electrochemical and Plasma Electrolytic Modification of Metal Surfaces  |o 5th International Conference  |v [P. 1274-1283]  |d 2016 
610 1 |a электронный ресурс 
610 1 |a труды учёных ТПУ 
610 1 |a mechanical properties 
610 1 |a structures 
610 1 |a magnetron sputtering 
610 1 |a механические свойства 
610 1 |a термическая стабильность 
610 1 |a высокие температуры 
701 1 |a Musil  |b Y.  |c physicist  |c Leading researcher of Tomsk Polytechnic University, Doctor of physical and mathematical sciences  |f 1934-  |g Yindrikh  |3 (RuTPU)RU\TPU\pers\36957 
701 1 |a Remnev (Remnyov)  |b G. E.  |c physicist  |c Professor of Tomsk Polytechnic University, Doctor of technical sciences  |f 1948-  |g Gennady Efimovich  |3 (RuTPU)RU\TPU\pers\31500  |9 15661 
701 1 |a Legostaev  |b V. N.  |g Viktor Nikiforovich 
701 1 |a Uglov  |b V. V.  |c Physicist  |c Leading researcher of Tomsk Polytechnic University, Doctor of physical and mathematical sciences  |f 1954-  |g Vladimir Vasilievich  |3 (RuTPU)RU\TPU\pers\36737 
701 1 |a Lebedinsky  |b A. M.  |c electrophysicist  |c Associate Scientist of Tomsk Polytechnic University, candidate of physico-mathematical Sciences  |f 1982-  |g Aleksey Mikhaylovich  |3 (RuTPU)RU\TPU\pers\36499 
701 1 |a Lauk  |b A. L.  |c Physicist  |c Leading engineer of Tomsk Polytechnic University  |f 1957-  |g Aleksandr Lukyanovich  |3 (RuTPU)RU\TPU\pers\37675 
701 1 |a Prochazka  |b J . 
701 1 |a Haviar  |b S. 
701 1 |a Smolyanskiy (Smolyansky, Smolyanskii)  |b E. A.  |c Physicist  |c Research Engineer of Tomsk Polytechnic University  |f 1985-  |g Egor Aleksandrovich  |3 (RuTPU)RU\TPU\pers\37673  |9 20478 
712 0 2 |a Национальный исследовательский Томский политехнический университет (ТПУ)  |b Институт физики высоких технологий (ИФВТ)  |b Лаборатория № 1  |3 (RuTPU)RU\TPU\col\19035 
801 2 |a RU  |b 63413507  |c 20200717  |g RCR 
850 |a 63413507 
856 4 |u http://dx.doi.org/10.1016/j.surfcoat.2016.05.054 
942 |c CF