Properties of ultra-thin Cu films grown by high power pulsed magnetron sputtering; Thin Solid Films; Vol. 631

Bibliographische Detailangaben
Parent link:Thin Solid Films.— , 1967-
Vol. 631.— 2017.— [P. 72-79]
Körperschaft: Национальный исследовательский Томский политехнический университет (ТПУ) Физико-технический институт (ФТИ) Кафедра экспериментальной физики (ЭФ)
Weitere Verfasser: Soloviev A. A. Andrey Aleksandrovich, Semenov V. A. Vyacheslav Arkadjevich, Oskirko V. O. Vladimir Olegovich, Oskomov K. V. Konstantin Vladimirovich, Zakharov A. N. Aleksandr Nikolaevich, Rabotkin S. V. Sergey Viktorovich
Zusammenfassung:Title screen
Because of the superior properties of copper, it has been of great interest as a conducting material to replace Al in device manufacturing and Ag in multilayer low-emission coatings. In this study, we investigated the influence of the pulsing frequency and the ion-to-atom ratio at direct-current (DC) and high power impulse magnetron sputtering on the structural, optical and electrical properties of Cu films of thickness less than 25 nm. The ratio of ion flux to deposited atom flux at the substrate was varied by changing the average discharge current density during the pulse from 26 to 1220 mA/cm2 and pulse repetition rate from 0.5 to 5 kHz. Properties of nanometerthick Cu films were found to be very sensitive to the ion-to-atom ratio. The Cu films were deposited with islandtype growth. For the experimental conditions employed in the present study low-resistivity ultra-thin Cu films were obtained at moderate average discharge current density during the pulse (340 mA/cm2 ), pulse frequency of 3 kHz and ion-to-atom ratio of 1.5. We also determined the critical thickness at which Cu films exhibit continuous growth as 5-6 nm. At this thickness films deposited under optimum conditions have resistivity of about 8 μΩ·cm, which is 8 times smaller than for films deposited by DC magnetron sputtering. This difference is due to the fact that films grown in DC regime have twice the concentration of oxygen atoms.
Режим доступа: по договору с организацией-держателем ресурса
Sprache:Englisch
Veröffentlicht: 2017
Schlagworte:
Online-Zugang:https://doi.org/10.1016/j.tsf.2017.04.005
Format: Elektronisch Buchkapitel
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=655534

MARC

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200 1 |a Properties of ultra-thin Cu films grown by high power pulsed magnetron sputtering  |f A. A. Soloviev [et al.] 
203 |a Text  |c electronic 
300 |a Title screen 
320 |a [References: p.79 (39 tit.)] 
330 |a Because of the superior properties of copper, it has been of great interest as a conducting material to replace Al in device manufacturing and Ag in multilayer low-emission coatings. In this study, we investigated the influence of the pulsing frequency and the ion-to-atom ratio at direct-current (DC) and high power impulse magnetron sputtering on the structural, optical and electrical properties of Cu films of thickness less than 25 nm. The ratio of ion flux to deposited atom flux at the substrate was varied by changing the average discharge current density during the pulse from 26 to 1220 mA/cm2 and pulse repetition rate from 0.5 to 5 kHz. Properties of nanometerthick Cu films were found to be very sensitive to the ion-to-atom ratio. The Cu films were deposited with islandtype growth. For the experimental conditions employed in the present study low-resistivity ultra-thin Cu films were obtained at moderate average discharge current density during the pulse (340 mA/cm2 ), pulse frequency of 3 kHz and ion-to-atom ratio of 1.5. We also determined the critical thickness at which Cu films exhibit continuous growth as 5-6 nm. At this thickness films deposited under optimum conditions have resistivity of about 8 μΩ·cm, which is 8 times smaller than for films deposited by DC magnetron sputtering. This difference is due to the fact that films grown in DC regime have twice the concentration of oxygen atoms. 
333 |a Режим доступа: по договору с организацией-держателем ресурса 
461 1 |t Thin Solid Films  |d 1967- 
463 1 |t Vol. 631  |v [P. 72-79]  |d 2017 
610 1 |a электронный ресурс 
610 1 |a труды учёных ТПУ 
610 1 |a copper 
610 1 |a импульсные магнетроны 
610 1 |a низкоэмиссионные покрытия 
610 1 |a электрофизические свойства 
610 1 |a оптические свойства 
701 1 |a Soloviev  |b A. A.  |c specialist in the field of hydrogen energy  |c Associate Professor of Tomsk Polytechnic University, Candidate of technical sciences  |f 1977-  |g Andrey Aleksandrovich  |3 (RuTPU)RU\TPU\pers\30863 
701 1 |a Semenov  |b V. A.  |g Vyacheslav Arkadjevich 
701 1 |a Oskirko  |b V. O.  |g Vladimir Olegovich 
701 1 |a Oskomov  |b K. V.  |g Konstantin Vladimirovich 
701 1 |a Zakharov  |b A. N.  |g Aleksandr Nikolaevich 
701 1 |a Rabotkin  |b S. V.  |g Sergey Viktorovich 
712 0 2 |a Национальный исследовательский Томский политехнический университет (ТПУ)  |b Физико-технический институт (ФТИ)  |b Кафедра экспериментальной физики (ЭФ)  |3 (RuTPU)RU\TPU\col\21255 
801 2 |a RU  |b 63413507  |c 20170911  |g RCR 
856 4 |u https://doi.org/10.1016/j.tsf.2017.04.005 
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