The dynamic sublayers for improving the adhesion of CVD diamond films on copper

Detaylı Bibliyografya
Parent link:Journal of Physics: Conference Series
Vol. 830 : Energy Fluxes and Radiation Effects 2016.— 2017.— [012102, 5 p.]
Yazar: Gaydaychuk A. V. Alexander Valerievich
Müşterek Yazar: Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Лаборатория № 1
Diğer Yazarlar: Linnik S. A. Stepan Andreevich, Okhotnikov V. V. Vitaly Vladimirovich
Özet:Title screen
Polycrystalline diamond films were fabricated on copper substrates by a multi-step process comprised of physical vapor deposition of Al-based composite interlayer on Cu substrate and depositing continuous diamond film on composite interlayer by plasma assisted chemical vapor deposition (PACVD). The interface characteristics and adhesion strength were investigated by Auger electron spectroscopy, Raman analysis, calotest and indentation test. The results show that the continuous film without cracks is successfully obtained. The improved adhesion between diamond film and substrate results from the low residual stress in the film due to their compensation by Al interlayer in the sample cooling process.
Dil:İngilizce
Baskı/Yayın Bilgisi: 2017
Seri Bilgileri:Modification of materials with particle beams and plasma flows
Konular:
Online Erişim:http://dx.doi.org/10.1088/1742-6596/830/1/012102
http://earchive.tpu.ru/handle/11683/39488
Materyal Türü: Elektronik Kitap Bölümü
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=654920

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