The dynamic sublayers for improving the adhesion of CVD diamond films on copper; Journal of Physics: Conference Series; Vol. 830 : Energy Fluxes and Radiation Effects 2016

Chi tiết về thư mục
Parent link:Journal of Physics: Conference Series
Vol. 830 : Energy Fluxes and Radiation Effects 2016.— 2017.— [012102, 5 p.]
Tác giả chính: Gaydaychuk A. V. Alexander Valerievich
Tác giả của công ty: Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Лаборатория № 1
Tác giả khác: Linnik S. A. Stepan Andreevich, Okhotnikov V. V. Vitaly Vladimirovich
Tóm tắt:Title screen
Polycrystalline diamond films were fabricated on copper substrates by a multi-step process comprised of physical vapor deposition of Al-based composite interlayer on Cu substrate and depositing continuous diamond film on composite interlayer by plasma assisted chemical vapor deposition (PACVD). The interface characteristics and adhesion strength were investigated by Auger electron spectroscopy, Raman analysis, calotest and indentation test. The results show that the continuous film without cracks is successfully obtained. The improved adhesion between diamond film and substrate results from the low residual stress in the film due to their compensation by Al interlayer in the sample cooling process.
Ngôn ngữ:Tiếng Anh
Được phát hành: 2017
Loạt:Modification of materials with particle beams and plasma flows
Những chủ đề:
Truy cập trực tuyến:http://dx.doi.org/10.1088/1742-6596/830/1/012102
http://earchive.tpu.ru/handle/11683/39488
Định dạng: Điện tử Chương của sách
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=654920

Những quyển sách tương tự