Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing; Surface and Coatings Technology; Vol. 306, Pt. A : Surface Modification of Materials by Ion Beams (SMMIB 2015)

Dades bibliogràfiques
Parent link:Surface and Coatings Technology
Vol. 306, Pt. A : Surface Modification of Materials by Ion Beams (SMMIB 2015).— 2016.— [P. 21–24]
Autor corporatiu: Национальный исследовательский Томский политехнический университет (ТПУ) Физико-технический институт (ФТИ) Кафедра экспериментальной физики (ЭФ), Национальный исследовательский Томский политехнический университет (ТПУ) Физико-технический институт (ФТИ) Лаборатория № 22
Altres autors: Stepanov I. B. Igor Borisovich, Ryabchikov A. I. Aleksandr Ilyich, Ananin P. S. Petr Semenovich, Sivin D. O. Denis Olegovich, Shevelev A. E. Aleksey Eduardovich, Zhelomsky S. G. Sergey Gennadjevich
Sumari:Title screen
The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., −2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or N1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed.
Режим доступа: по договору с организацией-держателем ресурса
Idioma:anglès
Publicat: 2016
Matèries:
Accés en línia:http://dx.doi.org/10.1016/j.surfcoat.2016.04.003
Format: Electrònic Capítol de llibre
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=654160

MARC

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200 1 |a Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing  |f I. B. Stepanov [et al.] 
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320 |a [References: p. 24 (22 tit.)] 
330 |a The paper presents the results of an experimental study of accumulation of copper macroparticles (MP) on a negatively biased substrate immersed in DC vacuum arc plasma. The influence of normal and tangential magnetic fields and high-frequency short-pulsed negative bias was investigated. The joint application of a tangential magnetic field and high frequency short-pulsed negative bias provides an effect of MP multifold suppression. With a tangential magnetic field strength of 175 Gs and repetitively pulsed bias (7 μs, 105 p.p.s., −2 kV), total suppression efficiency is 250-fold after 6 min of ion-plasma treatment. For macroparticles with the diameter of less or N1 μm, the efficiency is 3000-fold or 70-fold, respectively. In comparison with an axisymmetric vacuum-arc plasma source, the application of a steered arc ensures a 10-fold reduction in MP density on a substrate immersed in copper vacuum-arc plasma. The possibility of ion implantation using low-energy high-frequency short-pulse plasma immersion by implementing DC vacuum arc plasma is discussed. 
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461 1 |t Surface and Coatings Technology 
463 1 |t Vol. 306, Pt. A : Surface Modification of Materials by Ion Beams (SMMIB 2015)  |v [P. 21–24]  |o The 19th International Conference, 25 November 2016  |d 2016 
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701 1 |a Ryabchikov  |b A. I.  |c Professor of Tomsk Polytechnic University, Doctor of physical and mathematical sciences  |c physicist  |f 1950-  |g Aleksandr Ilyich  |3 (RuTPU)RU\TPU\pers\30912 
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