Microstructure of amorphous copper-carbon thin films formed by plasma-enhanced chemical vapor deposition

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Parent link:High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes.— , 1997-
Vol. 20, iss. 2.— 2016.— [P. 115-126]
Tác giả của công ty: Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Лаборатория № 1
Tác giả khác: Astashinskaya M. V. Marina Viktorovna, Astashinsky V. V. Valentin Valentinovich, Kvasov N. T. Nikolay Trafimovich, Uglov V. V. Vladimir Vasilievich
Tóm tắt:Title screen
The microstructure of copper-carbon Cu/a-C:H nanocomposites formed by plasma-enhanced chemical vapor deposition has been determined by transmission electron microscopy. The formation of spherical copper inclusions embedded in the matrix of amorphous carbon was observed. The average size of the copper inclusions decreases from 16 to 5 nm on increasing the carbon concentration from 8 to 75 at.%. A description of the copper clusters formation processes in the reactor chamber was proposed. The results of calculation of the average size of copper clusters are in good agreement with the observed size of the copper inclusions formed in nanocomposite thin films.
Режим доступа: по договору с организацией-держателем ресурса
Ngôn ngữ:Tiếng Anh
Được phát hành: 2016
Những chủ đề:
Truy cập trực tuyến:http://dx.doi.org/10.1615/HighTempMatProc.2016017797
Định dạng: Điện tử Chương của sách
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=653374

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