Microstructure of amorphous copper-carbon thin films formed by plasma-enhanced chemical vapor deposition; High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes; Vol. 20, iss. 2

Microstructure of amorphous copper-carbon thin films formed by plasma-enhanced chemical vapor deposition

Bibliographic Details
Parent link:High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes.— , 1997-
Vol. 20, iss. 2.— 2016.— [P. 115-126]
Corporate Author: Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Лаборатория № 1
Other Authors: Astashinskaya M. V. Marina Viktorovna, Astashinsky V. V. Valentin Valentinovich, Kvasov N. T. Nikolay Trafimovich, Uglov V. V. Vladimir Vasilievich
Summary:Title screen
The microstructure of copper-carbon Cu/a-C:H nanocomposites formed by plasma-enhanced chemical vapor deposition has been determined by transmission electron microscopy. The formation of spherical copper inclusions embedded in the matrix of amorphous carbon was observed. The average size of the copper inclusions decreases from 16 to 5 nm on increasing the carbon concentration from 8 to 75 at.%. A description of the copper clusters formation processes in the reactor chamber was proposed. The results of calculation of the average size of copper clusters are in good agreement with the observed size of the copper inclusions formed in nanocomposite thin films.
Режим доступа: по договору с организацией-держателем ресурса
Language:English
Published: 2016
Subjects:
электронный ресурс
труды учёных ТПУ
композитные покрытия
пленки
нанокластеры
микроструктура
осаждение
плазменно-химическое осаждение
химическое осаждение
пары
Online Access:http://dx.doi.org/10.1615/HighTempMatProc.2016017797
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=653374
Description
Summary:Title screen
The microstructure of copper-carbon Cu/a-C:H nanocomposites formed by plasma-enhanced chemical vapor deposition has been determined by transmission electron microscopy. The formation of spherical copper inclusions embedded in the matrix of amorphous carbon was observed. The average size of the copper inclusions decreases from 16 to 5 nm on increasing the carbon concentration from 8 to 75 at.%. A description of the copper clusters formation processes in the reactor chamber was proposed. The results of calculation of the average size of copper clusters are in good agreement with the observed size of the copper inclusions formed in nanocomposite thin films.
Режим доступа: по договору с организацией-держателем ресурса
DOI:10.1615/HighTempMatProc.2016017797

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