Use of a thin liquid film moving under the action of gas flow in a mini-channel for removing high heat fluxes

Use of a thin liquid film moving under the action of gas flow in a mini-channel for removing high heat fluxes

Bibliographic Details
Parent link:MATEC Web of Conferences
Vol. 92 : Thermophysical Basis of Energy Technologies (TBET-2016).— 2017.— [01037, 4 p.]
Corporate Author: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра атомных и тепловых электростанций (АТЭС)
Other Authors: Zaitsev D. V. Dmitry Valerievich, Tkachenko E. Egor, Orlik E. Evgeny, Kabov O. Oleg
Summary:Title screen
Intensively evaporating liquid films shear-driven in a mini- or micro-channel under the action of cocurrent gas flow are promising for the use in modern cooling systems of semiconductor devices. In this work, we investigated the influence of liquid and gas flow rates on the critical heat flux in a locally heated film of water, moving under the action of air flow in a mini-channel. In experiments a record value of critical heat flux of 870 W/cm{2} was reached. Heat spreading into the substrate and heat losses to the atmosphere in total do not exceed 25 % at heat fluxes above 400 W/cm{2} . A comparison with the critical heat flux for water flow boiling in the channel shows that, for shear-driven liquid films the critical heat flux is almost an order of magnitude higher.
Language:English
Published: 2017
Subjects:
электронный ресурс
труды учёных ТПУ
тонкие пленки
жидкости
потоки газов
тепловые потоки
охлаждение
полупроводниковые приборы
Online Access:http://dx.doi.org/10.1051/matecconf/20179201037
http://earchive.tpu.ru/handle/11683/36692
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=652984

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