Analyzing the thermal regime of power supply units in portable betatrons by using infrared thermography; MATEC Web of Conferences; Vol. 92 : Thermophysical Basis of Energy Technologies (TBET-2016)

Détails bibliographiques
Parent link:MATEC Web of Conferences
Vol. 92 : Thermophysical Basis of Energy Technologies (TBET-2016).— 2017.— [01017, 4 p.]
Collectivités auteurs: Национальный исследовательский Томский политехнический университет (ТПУ) Институт неразрушающего контроля (ИНК) Лаборатория № 51 (Радиационных испытаний материалов и изделий), Национальный исследовательский Томский политехнический университет (ТПУ) Институт неразрушающего контроля (ИНК) Лаборатория № 41 (Разработка бетатронов)
Autres auteurs: Simonova O. S. Olga Sergeevna, Kasyanov (Kas'yanov) V. A. Valery Alekseevich, Moskovchenko A. I., Xingwang G.
Résumé:Title screen
Potentials of infrared thermography in analyzing a thermal regime of the 7.5 MeV betatron power supply are discussed. Both the heating rate and thermal inertia of particular electronic components have been evaluated by processing pixel-based temperature histories. The data treatment has been performed by using the original ThermoFit Pro software to illustrate that some advanced processing algorithms, such as the Fourier transform and principle component analysis, are valuable in identifying thermal dynamics of particular power supply parts.
Langue:anglais
Publié: 2017
Sujets:
Accès en ligne:http://dx.doi.org/10.1051/matecconf/20179201017
http://earchive.tpu.ru/handle/11683/36724
Format: Électronique Chapitre de livre
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=652957
Description
Résumé:Title screen
Potentials of infrared thermography in analyzing a thermal regime of the 7.5 MeV betatron power supply are discussed. Both the heating rate and thermal inertia of particular electronic components have been evaluated by processing pixel-based temperature histories. The data treatment has been performed by using the original ThermoFit Pro software to illustrate that some advanced processing algorithms, such as the Fourier transform and principle component analysis, are valuable in identifying thermal dynamics of particular power supply parts.
DOI:10.1051/matecconf/20179201017