The fast neutron irradiation influence on the AlGaAs IR-LEDs reliability
| Parent link: | Microelectronics Reliability Vol. 65.— 2016.— [P. 55-59] |
|---|---|
| مؤلف مشترك: | |
| مؤلفون آخرون: | , , , |
| الملخص: | Title screen This paper represents the results of investigation of preliminary fast neutron irradiation influence on reliability of IR-LEDs manufactured on the basis of AlGaAs heterostructures. It is determined that design margin of LEDs is defined by catastrophic failures that are driven by mechanical destruction of LED packages rather than their lighting technology characteristics. The upper and lower limits of catastrophic failure probability are determined. In addition, the upper limit is shown to be dependent on the melt temperature of ohmic contact used to fix the chip to chip carrier. The preliminary fast neutron irradiation leads to the shift of defined temperature limits while the probability of catastrophic failure grows with neutron fluence that can be explained by lower radiation resistance of ohmic contact. |
| اللغة: | الإنجليزية |
| منشور في: |
2016
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://dx.doi.org/10.1016/j.microrel.2016.07.143 |
| التنسيق: | الكتروني فصل الكتاب |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=651544 |
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| 200 | 1 | |a The fast neutron irradiation influence on the AlGaAs IR-LEDs reliability |f A. V. Gradoboev [et al.] | |
| 203 | |a Text |c electronic | ||
| 300 | |a Title screen | ||
| 320 | |a [References: 16 tit.] | ||
| 330 | |a This paper represents the results of investigation of preliminary fast neutron irradiation influence on reliability of IR-LEDs manufactured on the basis of AlGaAs heterostructures. It is determined that design margin of LEDs is defined by catastrophic failures that are driven by mechanical destruction of LED packages rather than their lighting technology characteristics. The upper and lower limits of catastrophic failure probability are determined. In addition, the upper limit is shown to be dependent on the melt temperature of ohmic contact used to fix the chip to chip carrier. The preliminary fast neutron irradiation leads to the shift of defined temperature limits while the probability of catastrophic failure grows with neutron fluence that can be explained by lower radiation resistance of ohmic contact. | ||
| 461 | |t Microelectronics Reliability | ||
| 463 | |t Vol. 65 |v [P. 55-59] |d 2016 | ||
| 610 | 1 | |a электронный ресурс | |
| 610 | 1 | |a труды учёных ТПУ | |
| 610 | 1 | |a светоизлучающие диоды | |
| 610 | 1 | |a гетероструктуры | |
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| 701 | 1 | |a Gradoboev |b A. V. |c physicist |c Professor of Yurga technological Institute of Tomsk Polytechnic University, Doctor of technical sciences |f 1952- |g Aleksandr Vasilyevich |3 (RuTPU)RU\TPU\pers\34242 |9 17773 | |
| 701 | 1 | |a Orlova |b K. N. |c physicist |c Associate Professor of Yurga technological Institute of Tomsk Polytechnic University, Candidate of technical sciences |f 1985- |g Kseniya Nikolaevna |3 (RuTPU)RU\TPU\pers\33587 |9 17245 | |
| 701 | 1 | |a Asanov |b I. A. |g Ivan Aleksandrovich | |
| 701 | 1 | |a Simonova |b A. V. |g Anastasiya Vladimirovna | |
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