Modal testing circuit board assembly of an electronic apparatus by laser vibrometry; IOP Conference Series: Materials Science and Engineering; Vol. 156 : Materials and Technologies of New Generations in Modern Materials Science
| Parent link: | IOP Conference Series: Materials Science and Engineering Vol. 156 : Materials and Technologies of New Generations in Modern Materials Science.— 2016.— [012005, 7 p.] |
|---|---|
| Kurumsal yazarlar: | , |
| Diğer Yazarlar: | , , , , |
| Özet: | Title screen The operating capacity and service life of printed circuit boards in various electronic equipment and devices depends on their ability to resist vibroacoustic loads, including vibration and acoustic noises. In this paper, non-contact laser vibrometry has been applied to perform the modal analysis of a circuit board assembly in order to identify its vulnerable spots and to find solutions to protect the assembly from external vibroacoustic loads. A broadband periodic chirp signal was used to excite vibration, which enabled a rapid generation of results. The paper provides data on eigenfrequencies, vibration velocity fields, and vibration displacement profiles. Frequency ranges have been determined in which eigenfrequencies with the highest vibration amplification lie. The obtained data can be used to develop a quality control technique for printed circuit boards and to optimize their construction as early as the design stage. |
| Dil: | İngilizce |
| Baskı/Yayın Bilgisi: |
2016
|
| Konular: | |
| Online Erişim: | http://dx.doi.org/10.1088/1757-899X/156/1/012005 http://earchive.tpu.ru/handle/11683/36552 |
| Materyal Türü: | Elektronik Kitap Bölümü |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=651418 |
MARC
| LEADER | 00000nla2a2200000 4500 | ||
|---|---|---|---|
| 001 | 651418 | ||
| 005 | 20231101134652.0 | ||
| 035 | |a (RuTPU)RU\TPU\network\16667 | ||
| 035 | |a RU\TPU\network\16664 | ||
| 090 | |a 651418 | ||
| 100 | |a 20161111a2016 k y0engy50 ba | ||
| 101 | 0 | |a eng | |
| 105 | |a y z 100zy | ||
| 135 | |a drcn ---uucaa | ||
| 181 | 0 | |a i | |
| 182 | 0 | |a b | |
| 200 | 1 | |a Modal testing circuit board assembly of an electronic apparatus by laser vibrometry |f V. A. Krasnoveikin [et al.] | |
| 203 | |a Text |c electronic | ||
| 300 | |a Title screen | ||
| 320 | |a [References: 11 tit.] | ||
| 330 | |a The operating capacity and service life of printed circuit boards in various electronic equipment and devices depends on their ability to resist vibroacoustic loads, including vibration and acoustic noises. In this paper, non-contact laser vibrometry has been applied to perform the modal analysis of a circuit board assembly in order to identify its vulnerable spots and to find solutions to protect the assembly from external vibroacoustic loads. A broadband periodic chirp signal was used to excite vibration, which enabled a rapid generation of results. The paper provides data on eigenfrequencies, vibration velocity fields, and vibration displacement profiles. Frequency ranges have been determined in which eigenfrequencies with the highest vibration amplification lie. The obtained data can be used to develop a quality control technique for printed circuit boards and to optimize their construction as early as the design stage. | ||
| 461 | 0 | |0 (RuTPU)RU\TPU\network\2008 |t IOP Conference Series: Materials Science and Engineering | |
| 463 | 0 | |0 (RuTPU)RU\TPU\network\16647 |t Vol. 156 : Materials and Technologies of New Generations in Modern Materials Science |o International Conference and Youth Scientific School, 9–11 June 2016, Tomsk, Russia |o [proceedings] |f National Research Tomsk Polytechnic University (TPU) |v [012005, 7 p.] |d 2016 | |
| 610 | 1 | |a электронный ресурс | |
| 610 | 1 | |a труды учёных ТПУ | |
| 610 | 1 | |a тестирование | |
| 610 | 1 | |a электронные устройства | |
| 610 | 1 | |a виброметрия | |
| 610 | 1 | |a печатные платы | |
| 610 | 1 | |a вибрации | |
| 610 | 1 | |a акустические шумы | |
| 701 | 1 | |a Krasnoveikin |b V. A. | |
| 701 | 1 | |a Smolin |b I. Yu. |c specialist in the field of material science |c Senior Researcher of Tomsk Polytechnic University |f 1963- |g Igor Yurievich |2 stltpush |3 (RuTPU)RU\TPU\pers\34808 | |
| 701 | 1 | |a Druzhinin |b N. V. | |
| 701 | 1 | |a Kolubaev |b E. A. | |
| 701 | 1 | |a Derusova |b D. A. |c chemist |c engineer of Tomsk Polytechnic University |f 1989- |g Dariya Aleksandrovna |2 stltpush |3 (RuTPU)RU\TPU\pers\35097 | |
| 712 | 0 | 2 | |a Национальный исследовательский Томский политехнический университет (ТПУ) |b Институт природных ресурсов (ИПР) |b Кафедра физической и аналитической химии (ФАХ) |h 94 |2 stltpush |3 (RuTPU)RU\TPU\col\18656 |
| 712 | 0 | 2 | |a Национальный исследовательский Томский политехнический университет (ТПУ) |b Институт физики высоких технологий (ИФВТ) |b Кафедра физики высоких технологий в машиностроении (ФВТМ) |b Научно-образовательная лаборатория "Динамическое моделирование и контроль ответственных конструкций" (НОЛ ДМиК ОК) |h 7378 |2 stltpush |3 (RuTPU)RU\TPU\col\20773 |
| 801 | 2 | |a RU |b 63413507 |c 20170330 |g RCR | |
| 856 | 4 | |u http://dx.doi.org/10.1088/1757-899X/156/1/012005 | |
| 856 | 4 | |u http://earchive.tpu.ru/handle/11683/36552 | |
| 942 | |c CF | ||