The Additives Influence on Heat-Conducting Properties of Aluminium Nitride Circuit Boards; Key Engineering Materials; Vol. 712 : Advanced Materials for Technical and Medical Purpose (AMTMP 2016)

The Additives Influence on Heat-Conducting Properties of Aluminium Nitride Circuit Boards; Key Engineering Materials; Vol. 712 : Advanced Materials for Technical and Medical Purpose (AMTMP 2016)

Bibliographic Details
Parent link:Key Engineering Materials: Scientific Journal
Vol. 712 : Advanced Materials for Technical and Medical Purpose (AMTMP 2016).— 2016.— [P. 226-231]
Corporate Author: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электропривода и электрооборудования (ЭПЭО)
Other Authors: Karakulov A. S. Aleksandr Sergeevich, Gusev N. V. Nikolay Vladimirovich, Drozdov Yu. Yu. Yury Yurievich, Nikonova N. Y.
Summary:Title screen
The paper presents the studies on evaluation of the influence of modified additives of Y[2]O[3-], ZrO[2-] and Li[2]O[3-] type on heat-conductive properties of aluminium-nitride ceramics used as circuit boards. Sintering of the studied samples was carried out using AlN powders and the powders of the modifying additives, mixed in the ball mill based on the spark plasma sintering system "SPS”. Density and heat conductivity were measured for the obtained samples. It was ascertained that the most significant level of heat conductivity was obtained when using the additive mixture made of 7 wt. % of Li[2]O[3] and 3wt. % of Y[2]O[3], which reaches the level of 160 W/m·K. In addition, the results of the studies show that the addition of the modified powders leads to a significant increase of density; the additive consisting of 7wt.% of Li[2]O[3] and 3wt.% of Y[2]O[3] produces the greatest effect.
Режим доступа: по договору с организацией-держателем ресурса
Language:English
Published: 2016
Series:Materials and Technologies in Powder Metallurgy and Additive Manufacturing
Subjects:
электронный ресурс
труды учёных ТПУ
добавки
теплопроводность
нитрид алюминия
керамика
модифицирующие добавки
искровое плазменное спекание
субстраты
Online Access:http://dx.doi.org/10.4028/www.scientific.net/KEM.712.226
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=651323

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