Computer Simulation of Replaceable Many Sider Plates (RMSP) with Enhanced Chip-Breaking Characteristics

গ্রন্থ-পঞ্জীর বিবরন
Parent link:IOP Conference Series: Materials Science and Engineering
Vol. 142 : Innovative Technologies in Engineering.— 2016.— [012064, 7 p.]
সংস্থা লেখক: Национальный исследовательский Томский политехнический университет (ТПУ) Юргинский технологический институт (филиал) (ЮТИ) Кафедра технологии машиностроения (ТМС), Национальный исследовательский Томский политехнический университет (ТПУ) Юргинский технологический институт (филиал) (ЮТИ) Кафедра информационных систем (ИС)
অন্যান্য লেখক: Korchuganova M. A. Marina Anatolievna, Syrbakov A. P. Andrey Pavlovich, Chernysheva T. Yu. Tatiana Yurievna, Ivanov G., Gnedasch E.
সংক্ষিপ্ত:Title screen
Out of all common chip curling methods, a special tool face form has become the most widespread which is developed either by means of grinding or by means of profile pressing in the production process of RMSP. Currently, over 15 large tool manufacturers produce tools using instrument materials of over 500 brands. To this, we must add a large variety of tool face geometries, which purpose includes the control over form and dimensions of the chip. Taking into account all the many processed materials, specific tasks of the process planner, requirements to the quality of manufactured products, all this makes the choice of a proper tool which can perform the processing in the most effective way significantly harder. Over recent years, the nomenclature of RMSP for lathe tools with mechanical mounting has been considerably broadened by means of diversification of their faces.
ভাষা:ইংরেজি
প্রকাশিত: 2016
বিষয়গুলি:
অনলাইন ব্যবহার করুন:http://dx.doi.org/10.1088/1757-899X/142/1/012064
http://earchive.tpu.ru/handle/11683/34747
বিন্যাস: বৈদ্যুতিক গ্রন্থের অধ্যায়
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=650436

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