Development of a Metal Cutting Tool Fase in Order to Create the Conditions of Ringed Chips Wrapping; IOP Conference Series: Materials Science and Engineering; Vol. 142 : Innovative Technologies in Engineering

Xehetasun bibliografikoak
Parent link:IOP Conference Series: Materials Science and Engineering
Vol. 142 : Innovative Technologies in Engineering.— 2016.— [012063, 8 p.]
Egile korporatiboa: Национальный исследовательский Томский политехнический университет (ТПУ) Юргинский технологический институт (филиал) (ЮТИ) Кафедра технологии машиностроения (ТМС), Национальный исследовательский Томский политехнический университет (ТПУ) Юргинский технологический институт (филиал) (ЮТИ) Кафедра информационных систем (ИС)
Beste egile batzuk: Korchuganova M. A. Marina Anatolievna, Syrbakov A. P. Andrey Pavlovich, Chernysheva T. Yu. Tatiana Yurievna, Ivanov G., Korchuganov M. A. Maksim Anatolievich
Gaia:Title screen
When processing ductile metals with high cutting speed, there is a need to take additional measures for a comfortable and safe formation and removal of chips. In the conditions of large-scale manufacture, it is recommended to produce flow chips in the form of short fragments, while in the conditions of small-lot and single-piece manufacture, it is reasonable to wrap the chips spirally with a rather small turn radius. Such way of chips formation reduces the time of its removal from the working area as well as facilitates its transportation and processing. In order to solve the problem of chip wrapping and breakage, almost all modern manufacturers of tools with replaceable many-sided plates (RMSP) followed the way of complication of tool faces and determination of the areas of effective chip breaking. On the one hand, the suggested solution turns out to be effective; however, as showed the analysis of recommended cutting modes for complex forms of RMSP made by leading manufacturers, they all correspond to the definite cross section of the cut-layer S/t=0.1.
Hizkuntza:ingelesa
Argitaratua: 2016
Gaiak:
Sarrera elektronikoa:http://dx.doi.org/10.1088/1757-899X/142/1/012063
http://earchive.tpu.ru/handle/11683/34746
Formatua: xMaterials Baliabide elektronikoa Liburu kapitulua
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=650433