Regimes of water droplet evaporation on copper substrates; Colloid Journal; Vol. 78, iss. 3
| Parent link: | Colloid Journal.— , 2000- Vol. 78, iss. 3.— 2016.— [P. 335-339] |
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| Müşterek Yazar: | |
| Diğer Yazarlar: | , , , |
| Özet: | Title screen Distilled water droplet evaporation has been studied on copper substrate surfaces with different degrees of roughness. Data on variations in the contact diameter have been employed to distinguish between the regimes of distilled water droplet spreading over the copper surfaces that proceed after the viscous regime. For each isolated regime, the duration has been determined as a fraction of the total evaporation time and the main physical processes have been described. Variations in contact angles have been analyzed as depending on copper surface temperature. It has been established that, as the substrate temperature is elevated, wetting becomes better, while the adhesion work remains almost unchanged, thereby indicating the absence of chemical and structural transformations at the liquid–substrate interface. Режим доступа: по договору с организацией-держателем ресурса |
| Dil: | İngilizce |
| Baskı/Yayın Bilgisi: |
2016
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| Konular: | |
| Online Erişim: | http://dx.doi.org/10.1134/S1061933X1603008X |
| Materyal Türü: | Elektronik Kitap Bölümü |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=650095 |
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| 200 | 1 | |a Regimes of water droplet evaporation on copper substrates |f G. V. Kuznetsov, D. V. Feoktistov, E. G. Orlova, K. A. Batishcheva | |
| 203 | |a Text |c electronic | ||
| 300 | |a Title screen | ||
| 320 | |a [References: 28 tit.] | ||
| 330 | |a Distilled water droplet evaporation has been studied on copper substrate surfaces with different degrees of roughness. Data on variations in the contact diameter have been employed to distinguish between the regimes of distilled water droplet spreading over the copper surfaces that proceed after the viscous regime. For each isolated regime, the duration has been determined as a fraction of the total evaporation time and the main physical processes have been described. Variations in contact angles have been analyzed as depending on copper surface temperature. It has been established that, as the substrate temperature is elevated, wetting becomes better, while the adhesion work remains almost unchanged, thereby indicating the absence of chemical and structural transformations at the liquid–substrate interface. | ||
| 333 | |a Режим доступа: по договору с организацией-держателем ресурса | ||
| 461 | |t Colloid Journal |d 2000- | ||
| 463 | |t Vol. 78, iss. 3 |v [P. 335-339] |d 2016 | ||
| 610 | 1 | |a электронный ресурс | |
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| 610 | 1 | |a испарение | |
| 701 | 1 | |a Kuznetsov |b G. V. |c Specialist in the field of heat power energy |c Professor of Tomsk Polytechnic University, Doctor of Physical and Mathematical Sciences |f 1949- |g Geny Vladimirovich |3 (RuTPU)RU\TPU\pers\31891 |9 15963 | |
| 701 | 1 | |a Feoktistov |b D. V. |c Specialist in the field of thermal engineering |c Associate Professor; Deputy Director of Tomsk Polytechnic University, Candidate of technical sciences |f 1983- |g Dmitriy Vladimirovich |y Tomsk |3 (RuTPU)RU\TPU\pers\34158 |9 17698 | |
| 701 | 1 | |a Orlova |b E. G. |c specialist in the field of thermal engineering |c Associate Professor of Tomsk Polytechnic University, Candidate of Physical and Mathematical Sciences |f 1991- |g Evgeniya Georgievna |3 (RuTPU)RU\TPU\pers\34157 |9 17697 | |
| 701 | 1 | |a Batishcheva |b K. A. |c specialist in the field of heat and power engineering |c engineer assistant of Tomsk Polytechnic University |f 1994- |g Kseniya Arturovna |3 (RuTPU)RU\TPU\pers\46973 |9 22571 | |
| 712 | 0 | 2 | |a Национальный исследовательский Томский политехнический университет |b Энергетический институт |b Кафедра теоретической и промышленной теплотехники |3 (RuTPU)RU\TPU\col\18679 |9 27132 |
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