Deposition of ultrahard Ti–Si–N coatings by pulsed high-current reactive magnetron sputtering; Technical Physics; Vol. 61, iss. 2
| Источник: | Technical Physics: Scientific Journal.— , 1931- Vol. 61, iss. 2.— 2016.— [P. 215-220] |
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| Автор-организация: | |
| Другие авторы: | , , , |
| Примечания: | Title screen We report on the results of investigation of properties of ultrahard Ti–Si–N coatings deposited by pulsed high-current magnetron reactive sputtering (discharge pulse voltage is 300–900 V, discharge pulse current is up to 200 A, pulse duration is 10–100 ?s, and pulse repetition rate is 20–2000 Hz). It is shown that for a short sputtering pulse (25 ?s) and a high discharge current (160 A), the films exhibit high hardness (66 GPa), wear resistance, better adhesion, and a lower sliding friction coefficient. The reason is an enhancement of ion bombardment of the growing coating due to higher plasma density in the substrate region (1013 cm–3) and a manifold increase in the degree of ionization of the plasma with increasing peak discharge current (mainly due to the material being sputtered). Режим доступа: по договору с организацией-держателем ресурса |
| Язык: | английский |
| Опубликовано: |
2016
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| Серии: | Physical Science Of Materials |
| Предметы: | |
| Online-ссылка: | http://dx.doi.org/10.1134/S1063784216020171 |
| Формат: | Электронный ресурс Статья |
| Запись в KOHA: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=648363 |
| Примечания: | Title screen We report on the results of investigation of properties of ultrahard Ti–Si–N coatings deposited by pulsed high-current magnetron reactive sputtering (discharge pulse voltage is 300–900 V, discharge pulse current is up to 200 A, pulse duration is 10–100 ?s, and pulse repetition rate is 20–2000 Hz). It is shown that for a short sputtering pulse (25 ?s) and a high discharge current (160 A), the films exhibit high hardness (66 GPa), wear resistance, better adhesion, and a lower sliding friction coefficient. The reason is an enhancement of ion bombardment of the growing coating due to higher plasma density in the substrate region (1013 cm–3) and a manifold increase in the degree of ionization of the plasma with increasing peak discharge current (mainly due to the material being sputtered). Режим доступа: по договору с организацией-держателем ресурса |
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| DOI: | 10.1134/S1063784216020171 |