The Feasibility of Usage TiN and CrN Barrier Sublayers for Improving the Adhesion of Polycrystalline Diamond Films on WC-Co Hard Alloys; Key Engineering Materials; Vol. 685 : High Technology: Research and Applications 2015 (HTRA 2015)

The Feasibility of Usage TiN and CrN Barrier Sublayers for Improving the Adhesion of Polycrystalline Diamond Films on WC-Co Hard Alloys; Key Engineering Materials; Vol. 685 : High Technology: Research and Applications 2015 (HTRA 2015)

Bibliografski detalji
Parent link:	Key Engineering Materials: Scientific Journal Vol. 685 : High Technology: Research and Applications 2015 (HTRA 2015).— 2016.— [P. 583-586]
Glavni autor:	Linnik S. A. Stepan Andreevich
Autor kompanije:	Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Лаборатория № 1
Daljnji autori:	Gaydaychuk A. V. Alexander Valerievich, Barishnikov E. Y.
Sažetak:	Title screen In the present study, the influence of Chromium nitride (CrN) and Titanium nitride (TiN) sublayers on the adhesion of polycrystalline diamond films applied to WC-Co substrates was investigated. CrN and TiN layers were deposited on WC-Co substrates by magnetron sputtering in Ar/N2 atmosphere. Synthesis of diamond films was conducted in an AC abnormal glow discharge CVD reactor. The phase composition of the films was characterized by small-angle X-ray diffraction (XRD). The adhesion of diamond films was compared by analysis of Rockwell indentation imprints. It was found that TiN does not react with the carbon of the diamond film while CrN almost completely converted into chromium carbide (Cr[3]C[2]). Adhesion tests showed that the efficiency of these sublayers usage is substantially lower than using a Murakami and HNO[3]/H[2]O pretreatment. Режим доступа: по договору с организацией-держателем ресурса
Jezik:	engleski
Izdano:	2016
Serija:	Advanced Materials and Alloys, Nanomaterials and Nanotechnology
Teme:	электронный ресурс труды учёных ТПУ адгезия алмазные пленки твердые сплавы магнетронное распыление поликристаллические пленки
Online pristup:	http://dx.doi.org/10.4028/www.scientific.net/KEM.685.583
Format:	Elektronički Poglavlje knjige
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=646489

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