Change of Dynamic Contact Angle of a Drop Spreading over Copper Surface; MATEC Web of Conferences; Vol. 37 : Smart Grids 2015

Change of Dynamic Contact Angle of a Drop Spreading over Copper Surface; MATEC Web of Conferences; Vol. 37 : Smart Grids 2015

Detalhes bibliográficos
Parent link:MATEC Web of Conferences
Vol. 37 : Smart Grids 2015.— 2015.— [01020, 5 p.]
Autor principal: Feoktistov D. V. Dmitriy Vladimirovich
Autor Corporativo: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра теоретической и промышленной теплотехники (ТПТ)
Outros Autores: Orlova E. G. Evgeniya Georgievna, Islamova A. G. Anastasiya Gomilievna
Resumo:Title screen
This work presents the comparison between the change of a dynamic contact angle during drop spreading over copper surfaces obtained in the experiment and calculated by using empirical correlations (Bracke et al., Jiang et al., Seebergh et al.). It is found that these correlations are applicable for the case of drop spreading over a smooth surface or over a rough surface into the low capillary number region (2.5·10{−7}). Dynamic contact angles obtained experimentally increase with increasing capillary number, besides it increases significantly on more rough surfaces. However the calculated values of angles do not depend on Ca.
Idioma:inglês
Publicado em: 2015
Assuntos:
электронный ресурс
труды учёных ТПУ
капли
медные поверхности
контактные углы
корреляции
Acesso em linha:http://dx.doi.org/10.1051/matecconf/20153701020
http://earchive.tpu.ru/handle/11683/32630
Formato: MixedMaterials Recurso Electrónico Capítulo de Livro
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=645634

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