The Formation of Gradient Submicrocrystalline Structure at Nickel Surface Layers under Ultrasonic Impact Treatment; AIP Conference Proceedings; Vol. 1683 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures

The Formation of Gradient Submicrocrystalline Structure at Nickel Surface Layers under Ultrasonic Impact Treatment; AIP Conference Proceedings; Vol. 1683 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures

Bibliografiske detaljer
Parent link:	AIP Conference Proceedings Vol. 1683 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures.— 2015.— [020176, 4 p.]
Corporate Authors:	Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Кафедра материаловедения в машиностроении (ММС), Национальный исследовательский Томский политехнический университет (ТПУ) Физико-технический институт (ФТИ) Кафедра общей физики (ОФ)
Andre forfattere:	Panin V. E. Viktor Evgenyevich, Kuznetsov P. V. Pavel Viktorovich, Pochivalov Yu., Belyaeva I., Rakhmatulina T., Shumakova D.
Summary:	Title screen Submicrocrystalline nickel produced by ultrasonic impact treatment was studied using scanning tunnel and optical microscopy. The size and grain boundary energy distributions were obtained depending on the distance from surface. It was found that regardless of processing mode ultrasonic impact treatment led to refinement of the thin surface layer comparable with initial grain size. Analysis of cumulative distribution functions for relative boundary energy allows us to study energy redistribution under treatment and qualitatively estimate low-angle and high-angle boundaries contributions. Режим доступа: по договору с организацией-держателем ресурса
Sprog:	engelsk
Udgivet:	2015
Fag:	электронный ресурс труды учёных ТПУ градиент структуры ультразвуковая обработка функции распределения туннельные микроскопы никель поверхностные слои лечение
Online adgang:	http://dx.doi.org/10.1063/1.4932866
Format:	Electronisk Book Chapter
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=644992

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