Evolution of Stress Concentration along CurvilinearModified Surface Layer-Base Material Interface. Numerical Simulation; AIP Conference Proceedings; Vol. 1683 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures

Evolution of Stress Concentration along CurvilinearModified Surface Layer-Base Material Interface. Numerical Simulation; AIP Conference Proceedings; Vol. 1683 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures

Detalles Bibliográficos
Parent link:	AIP Conference Proceedings Vol. 1683 : Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures.— 2015.— [020018, 4 p.]
Autor Corporativo:	Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Кафедра физики высоких технологий в машиностроении (ФВТМ)
Otros Autores:	Balokhonov R. R. Ruslan Revovich, Martynov S. A. Sergei, Romanova V. A. Varvara Aleksandrovna, Batukhtina E. E. Ekaterina
Sumario:	Title screen The interfacial mechanisms of the stress concentration in materials with modified surface layers are investigated. A dynamic boundary-value problem in a plane-strain formulation is solved numerically by the finitedifference method. Serrated and wavy base material-surface layer interfaces observed experimentally are assigned explicitly in calculations. Two stages in the evolution of the stress concentration are found to occur due to irregular interfacial geometry. The stress concentration in near-interfacial regions turns out to depend on the sinusoidal wavy interface thickness and roughness. Режим доступа: по договору с организацией-держателем ресурса
Lenguaje:	inglés
Publicado:	2015
Materias:	электронный ресурс труды учёных ТПУ эволюция концентрация напряжения поверхностные слои численное моделирование плоская деформация интерфейсы
Acceso en línea:	http://dx.doi.org/10.1063/1.4932708
Formato:	Electrónico Capítulo de libro
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=644859

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