A new approach to numerical analysis of reliability indices in electronics

A new approach to numerical analysis of reliability indices in electronics

Podrobná bibliografie
Parent link:European Physical Journal Web of Conferences (EPJ Web of Conferences)
Vol. 82 : Thermophysical Basis of Energy Technologies.— 2015.— [01029, 6 р.]
Hlavní autor: Kuznetsov G. V. Geny Vladimirovich
Korporace: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра теоретической и промышленной теплотехники (ТПТ), Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра автоматизации теплоэнергетических процессов (АТП)
Další autoři: Kravchenko E. V. Evgeny Vladimirovich
Shrnutí:Title screen
Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices.
Jazyk:angličtina
Vydáno: 2015
Témata:
электронный ресурс
труды учёных ТПУ
численный анализ
надежность
электроника
On-line přístup:http://dx.doi.org/10.1051/epjconf/20158201029
Médium: Elektronický zdroj Kapitola
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=643105

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