A new approach to numerical analysis of reliability indices in electronics
| Parent link: | European Physical Journal Web of Conferences (EPJ Web of Conferences) Vol. 82 : Thermophysical Basis of Energy Technologies.— 2015.— [01029, 6 р.] |
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| Egile korporatiboa: | , |
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| Gaia: | Title screen Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices. |
| Hizkuntza: | ingelesa |
| Argitaratua: |
2015
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| Gaiak: | |
| Sarrera elektronikoa: | http://dx.doi.org/10.1051/epjconf/20158201029 |
| Formatua: | Baliabide elektronikoa Liburu kapitulua |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=643105 |
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| 200 | 1 | |a A new approach to numerical analysis of reliability indices in electronics |f G. V. Kuznetsov, E. V. Kravchenko | |
| 203 | |a Text |c electronic | ||
| 300 | |a Title screen | ||
| 320 | |a [References: 15 tit.] | ||
| 330 | |a Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices. | ||
| 461 | 0 | |0 (RuTPU)RU\TPU\network\7958 |t European Physical Journal Web of Conferences (EPJ Web of Conferences) | |
| 463 | 0 | |0 (RuTPU)RU\TPU\network\7960 |t Vol. 82 : Thermophysical Basis of Energy Technologies |o Proceedings of the Conference, October 15-17, 2014, Tomsk, Russia |f National Research Tomsk Polytechnic University (TPU) ; eds. G. V. Kuznetsov [et al.] |v [01029, 6 р.] |d 2015 | |
| 610 | 1 | |a электронный ресурс | |
| 610 | 1 | |a труды учёных ТПУ | |
| 610 | 1 | |a численный анализ | |
| 610 | 1 | |a надежность | |
| 610 | 1 | |a электроника | |
| 700 | 1 | |a Kuznetsov |b G. V. |c Specialist in the field of heat power energy |c Professor of Tomsk Polytechnic University, Doctor of Physical and Mathematical Sciences |f 1949- |g Geny Vladimirovich |3 (RuTPU)RU\TPU\pers\31891 |9 15963 | |
| 701 | 1 | |a Kravchenko |b E. V. |c specialist in the field of power engineering |c Associate Professor of Tomsk Polytechnic University, Candidate of technical sciences |f 1981- |g Evgeny Vladimirovich |3 (RuTPU)RU\TPU\pers\32852 |9 16700 | |
| 712 | 0 | 2 | |a Национальный исследовательский Томский политехнический университет (ТПУ) |b Энергетический институт (ЭНИН) |b Кафедра теоретической и промышленной теплотехники (ТПТ) |3 (RuTPU)RU\TPU\col\18679 |
| 712 | 0 | 2 | |a Национальный исследовательский Томский политехнический университет (ТПУ) |b Энергетический институт (ЭНИН) |b Кафедра автоматизации теплоэнергетических процессов (АТП) |3 (RuTPU)RU\TPU\col\18678 |
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| 856 | 4 | |u http://dx.doi.org/10.1051/epjconf/20158201029 | |
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