A new approach to numerical analysis of reliability indices in electronics; European Physical Journal Web of Conferences (EPJ Web of Conferences); Vol. 82 : Thermophysical Basis of Energy Technologies
| Parent link: | European Physical Journal Web of Conferences (EPJ Web of Conferences) Vol. 82 : Thermophysical Basis of Energy Technologies.— 2015.— [01029, 6 р.] |
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| المؤلف الرئيسي: | |
| مؤلفون مشاركون: | , |
| مؤلفون آخرون: | |
| الملخص: | Title screen Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices. |
| اللغة: | الإنجليزية |
| منشور في: |
2015
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://dx.doi.org/10.1051/epjconf/20158201029 |
| التنسيق: | الكتروني فصل الكتاب |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=643105 |
| الملخص: | Title screen Spatial modeling of unsteady temperature fields is conducted in a microelectronic printed circuit board (PCB) with an account of convective and radiation heat transfer with the environment. The data for numerical modeling of temperature fields serve as a basis for determining the aging characteristics of the polymer material as a structural component of electronic engineering products. The obtained results allow concluding on the necessity to consider spatial nonuniform temperature fields when estimating the degree of polymeric materials degradation at the continuous service of products, as well as on the impact of polymer aging on reliability features of microelectronic devices. |
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| DOI: | 10.1051/epjconf/20158201029 |