Investigashion of copper-alluminum contact pair surface obtained by plasmodynamic method

Investigashion of copper-alluminum contact pair surface obtained by plasmodynamic method

Dades bibliogràfiques
Parent link:	International Congress on Energy Fluxes and Radiation Effects (EFRE-2014): abstracts. [P. 376].— , 2014
Autor corporatiu:	Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП)
Altres autors:	Kolganova J. L. Julia Leonidovna, Sivkov A. A. Aleksandr Anatolyevich, Saigash A. S. Anastasiya Sergeevna, Shanenkov I. I. Ivan Igorevich
Sumari:	Title screen
Idioma:	anglès
Publicat:	2014
Matèries:	электронный ресурс труды учёных ТПУ
Accés en línia:	http://www.hcei.tsc.ru/congress2014/images/Abstracts.pdf#page=376
Format:	Electrònic Capítol de llibre
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=642910

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