Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment; Journal of Engineering Physics and Thermophysics; Vol. 80, iss. 5

Sonraí bibleagrafaíochta
Parent link:Journal of Engineering Physics and Thermophysics: Scientific Journal
Vol. 80, iss. 5.— 2007.— [P. 1050-1054]
Príomhchruthaitheoir: Kuznetsov G. V. Geny Vladimirovich
Rannpháirtithe: Kravchenko E. V. Evgeny Vladimirovich
Achoimre:Title screen
Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the “aging” (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.
Режим доступа: по договору с организацией-держателем ресурса
Teanga:Béarla
Foilsithe / Cruthaithe: 2007
Ábhair:
Rochtain ar líne:http://dx.doi.org/10.1007/s10891-007-0137-2
Formáid: Leictreonach Caibidil leabhair
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=642735

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