Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment

Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment

Bibliographic Details
Parent link:Journal of Engineering Physics and Thermophysics: Scientific Journal
Vol. 80, iss. 5.— 2007.— [P. 1050-1054]
Main Author: Kuznetsov G. V. Geny Vladimirovich
Other Authors: Kravchenko E. V. Evgeny Vladimirovich
Summary:Title screen
Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the “aging” (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.
Режим доступа: по договору с организацией-держателем ресурса
Published: 2007
Subjects:
электронный ресурс
труды учёных ТПУ
Online Access:http://dx.doi.org/10.1007/s10891-007-0137-2
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=642735

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