Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment; Journal of Engineering Physics and Thermophysics; Vol. 80, iss. 5

Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment; Journal of Engineering Physics and Thermophysics; Vol. 80, iss. 5

Dettagli Bibliografici
Parent link:	Journal of Engineering Physics and Thermophysics: Scientific Journal Vol. 80, iss. 5.— 2007.— [P. 1050-1054]
Autore principale:	Kuznetsov G. V. Geny Vladimirovich
Altri autori:	Kravchenko E. V. Evgeny Vladimirovich
Riassunto:	Title screen Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the “aging” (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions. Режим доступа: по договору с организацией-держателем ресурса
Lingua:	inglese
Pubblicazione:	2007
Soggetti:	электронный ресурс труды учёных ТПУ
Accesso online:	http://dx.doi.org/10.1007/s10891-007-0137-2
Natura:	Elettronico Capitolo di libro
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=642735

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