The Influence of Thermal Diffusion on the Redistribution of Alloying Element between the Coating and Base under Surface Heating; Advanced Materials Research; Vol. 1040 : High Technology: Research and Applications 2014 (HTRA 2014)

The Influence of Thermal Diffusion on the Redistribution of Alloying Element between the Coating and Base under Surface Heating; Advanced Materials Research; Vol. 1040 : High Technology: Research and Applications 2014 (HTRA 2014)

Detaylı Bibliyografya
Parent link:	Advanced Materials Research: Scientific Journal Vol. 1040 : High Technology: Research and Applications 2014 (HTRA 2014).— 2014.— [P. 602-607]
Yazar:	Kryukova O. N. Olga Nikolaevna
Kurumsal yazarlar:	Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Учебно-научная межотраслевая междисциплинарная лаборатория "Моделирование физико-химических процессов в современных технологиях" (УНММЛ "МФХПСТ"), Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Кафедра физики высоких технологий в машиностроении (ФВТМ)
Diğer Yazarlar:	Chepak-Gizbrekht M. V. Mariya Vladimirovna
Özet:	Title screen The problem has been analyzed on alloying elements redistribution between the coating (containing Cr and N) and the substrate (Si) in condition of surface heating. The model takes into account the effect of thermal diffusion on the redistribution of elements. The analytical solution of the particular linearized problem about redistribution of elements in the substrate coating is presented. It is shown that the thermal diffusion significantly affects the impurity distribution, resulting in the appearance of supersaturated or depleted regions. Режим доступа: по договору с организацией-держателем ресурса
Dil:	İngilizce
Baskı/Yayın Bilgisi:	2014
Seri Bilgileri:	Simulation of Physical and Chemical Processes
Konular:	электронный ресурс труды учёных ТПУ аналитические решения интегральные преобразования поверхности термодиффузия
Online Erişim:	http://dx.doi.org/10.4028/www.scientific.net/AMR.1040.602
Materyal Türü:	Elektronik Kitap Bölümü
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=641094

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