Influence of Surface Treatment of Copper Substrates by Titanium Ions on Structure and Thermomechanical Properties of Nanocomposite Coatings on the Basis of Si-Al-N; Advanced Materials Research : Advanced materials, synthesis, development and application; Vol. 880 : Prospects of Fundamental Sciences Development (PFSD-2013)
| Parent link: | Advanced Materials Research : Advanced materials, synthesis, development and application: Scientific Journal Vol. 880 : Prospects of Fundamental Sciences Development (PFSD-2013).— 2014.— [P. 184-189] |
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| Autor Corporativo: | |
| Outros Autores: | , , , |
| Resumo: | Title screen Processing of copper substrates by Ti ions was carried out using "KVANT-03MI" equipment by means of a vacuum-arc ionic source with the titanium cathode. By X-ray and SEM methods it was established that after ionization in the surface layer of substrate the intermetallides of Cu-Ti system form. There is the CuTi3 preferred phase in surface layer of substrate depending on time of processing by Ti ions. The mechanism of formation of observable net structure of surface layer by sputtering of copper atoms by Ti ions the subsequent deposition and their crystallization in the form of microislets of CuTi3 intermetallide on surface of a copper substrate have been suggested. Режим доступа: по договору с организацией-держателем ресурса |
| Idioma: | inglês |
| Publicado em: |
2014
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| Colecção: | Chemistry and Physics of Materials Surface |
| Assuntos: | |
| Acesso em linha: | http://dx.doi.org/10.4028/www.scientific.net/AMR.880.184 |
| Formato: | Recurso Electrónico Capítulo de Livro |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=640703 |
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| 200 | 1 | |a Influence of Surface Treatment of Copper Substrates by Titanium Ions on Structure and Thermomechanical Properties of Nanocomposite Coatings on the Basis of Si-Al-N |f V. P. Sergeev [et al.] | |
| 203 | |a Text |c electronic | ||
| 225 | 1 | |a Chemistry and Physics of Materials Surface | |
| 300 | |a Title screen | ||
| 330 | |a Processing of copper substrates by Ti ions was carried out using "KVANT-03MI" equipment by means of a vacuum-arc ionic source with the titanium cathode. By X-ray and SEM methods it was established that after ionization in the surface layer of substrate the intermetallides of Cu-Ti system form. There is the CuTi3 preferred phase in surface layer of substrate depending on time of processing by Ti ions. The mechanism of formation of observable net structure of surface layer by sputtering of copper atoms by Ti ions the subsequent deposition and their crystallization in the form of microislets of CuTi3 intermetallide on surface of a copper substrate have been suggested. | ||
| 333 | |a Режим доступа: по договору с организацией-держателем ресурса | ||
| 461 | 0 | |0 (RuTPU)RU\TPU\network\4598 |t Advanced Materials Research : Advanced materials, synthesis, development and application |o Scientific Journal | |
| 463 | 0 | |0 (RuTPU)RU\TPU\network\4601 |t Vol. 880 : Prospects of Fundamental Sciences Development (PFSD-2013) |o The Xth International Conference, April 23-26, 2013, Tomsk, Russia |o [proceedings] |v [P. 184-189] |d 2014 | |
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