Increase resource power electronics module on the physics of failure method

Dades bibliogràfiques
Parent link:MATEC Web of Conferences
Vol. 19 : The 2nd International Youth Forum “Smart Grids”, Tomsk, Russia, October 6-10, 2014.— 2014.— [01028 [6 p.]]
Autor principal: Kravchenko E. V. Evgeny Vladimirovich
Autor corporatiu: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра автоматизации теплоэнергетических процессов (АТП), Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра теоретической и промышленной теплотехники (ТПТ)
Altres autors: Kuznetsov G. V. Geny Vladimirovich
Sumari:Title screen
A new approach to improving resource devices for power electronics. The numerical analysis of non-uniform temperature field of power semiconductor devices. A comparison of the intensities of the failure of a power unit with the real thermal regime of the device under conditions of natural convection and obtained by using statistical data analysis. The integrated assessment of reliability based on the methods of physics failures. The necessity of taking into account the actual non-stationary temperature fields to improve the reliability of the forecast operating life of power semiconductor devices.
Publicat: 2014
Matèries:
Accés en línia:http://dx.doi.org/10.1051/matecconf/20141901028
Format: Electrònic Capítol de llibre
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=640152
Descripció
Sumari:Title screen
A new approach to improving resource devices for power electronics. The numerical analysis of non-uniform temperature field of power semiconductor devices. A comparison of the intensities of the failure of a power unit with the real thermal regime of the device under conditions of natural convection and obtained by using statistical data analysis. The integrated assessment of reliability based on the methods of physics failures. The necessity of taking into account the actual non-stationary temperature fields to improve the reliability of the forecast operating life of power semiconductor devices.
DOI:10.1051/matecconf/20141901028