Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method

Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method

Xehetasun bibliografikoak
Parent link:	IOP Conference Series: Materials Science and Engineering Vol. 66: 20th International Conference for Students and Young Scientists: Modern Techniques and Technologies (MTT'2014), Tomsk, Russia, 14-18 April 2014.— 2014.— [012048, 5 p.]
Erakunde egilea:	Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП)
Beste egile batzuk:	Sivkov A. A. Aleksander Anatolyevich, Saygash A., Kolganova J. L. Julia Leonidovna, Shanenkov I. I. Ivan Igorevich
Gaia:	Title screen We obtained the contact pair copper–aluminum copper coating by using a magneto plasma accelerator. The process is realized during supersonic copper plasma jet flowing into the chamber filled with the air atmosphere. Copper jet is carried out of the accelerating channel towards the aluminum target. Plasma jet is generated by coaxial magnetoplasma accelerator (CMPA) based on copper electrode system. The CMPA is supplied from the pulsed capacitive energy storage with the maximum value of stored energy of 360 kJ. The obtained copper–aluminum contact pairs have been analyzed by X–ray diffractometry and Nano hardness tester. The copper coating on the aluminum surface is uniform with thickness about 100 gm. Also in this paper it is shown that transitional contact resistance of copper–aluminum contact pair is at 2,5 times less than a direct connection of copper and aluminum (test contact pair). Режим доступа: по договору с организацией-держателем ресурса
Hizkuntza:	ingelesa
Argitaratua:	2014
Gaiak:	электронный ресурс труды учёных ТПУ
Sarrera elektronikoa:	http://iopscience.iop.org/1757-899X/66/1/012048
Formatua:	Baliabide elektronikoa Liburu kapitulua
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637915

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