Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method; IOP Conference Series: Materials Science and Engineering; Vol. 66: 20th International Conference for Students and Young Scientists: Modern Techniques and Technologies (MTT'2014), Tomsk, Russia, 14-18 April 2014

Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method; IOP Conference Series: Materials Science and Engineering; Vol. 66: 20th International Conference for Students and Young Scientists: Modern Techniques and Technologies (MTT'2014), Tomsk, Russia, 14-18 April 2014

Bibliographische Detailangaben
Parent link:	IOP Conference Series: Materials Science and Engineering Vol. 66: 20th International Conference for Students and Young Scientists: Modern Techniques and Technologies (MTT'2014), Tomsk, Russia, 14-18 April 2014.— 2014.— [012048, 5 p.]
Körperschaft:	Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП)
Weitere Verfasser:	Sivkov A. A. Aleksander Anatolyevich, Saygash A., Kolganova J. L. Julia Leonidovna, Shanenkov I. I. Ivan Igorevich
Zusammenfassung:	Title screen We obtained the contact pair copper–aluminum copper coating by using a magneto plasma accelerator. The process is realized during supersonic copper plasma jet flowing into the chamber filled with the air atmosphere. Copper jet is carried out of the accelerating channel towards the aluminum target. Plasma jet is generated by coaxial magnetoplasma accelerator (CMPA) based on copper electrode system. The CMPA is supplied from the pulsed capacitive energy storage with the maximum value of stored energy of 360 kJ. The obtained copper–aluminum contact pairs have been analyzed by X–ray diffractometry and Nano hardness tester. The copper coating on the aluminum surface is uniform with thickness about 100 gm. Also in this paper it is shown that transitional contact resistance of copper–aluminum contact pair is at 2,5 times less than a direct connection of copper and aluminum (test contact pair). Режим доступа: по договору с организацией-держателем ресурса
Sprache:	Englisch
Veröffentlicht:	2014
Schlagworte:	электронный ресурс труды учёных ТПУ
Online-Zugang:	http://iopscience.iop.org/1757-899X/66/1/012048
Format:	Elektronisch Buchkapitel
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637915

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