Systems, methods, and apparatus for multilayer superconducting printed circuit boards
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| Sumari: | Title screen A superconducting printed circuit board, comprising a first electrically insulative substrate layer having a first surface and a second surface opposed to the first surface, at least a second electrically insulative substrate layer having a first surface and a second surface opposed to the first surface, the second electrically insulative substrate layer physically coupled to the first electrically insulative substrate layer, a first superconducting current path positioned on a first surface side of the first electrically insulative substrate layer, a second superconducting current path positioned between the first and second electrically insulative layer, and a third superconducting current path that extends through the first electrically insulative substrate layer and superconducting couples the first superconducting current path with the second superconducting current path. |
| Idioma: | anglès |
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| Accés en línia: | https://worldwide.espacenet.com/publicationDetails/biblio?DB=EPODOC&II=0&ND=3&adjacent=true&locale=ru_ru&FT=D&date=20090416&CC=WO&NR=2009046546A1&KC=A1# |
| Format: | Electrònic Llibre |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637202 |