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|c Pat.
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|c 20081009
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|a 20140604j20090416k y0engy50 ba
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|a Systems, methods, and apparatus for multilayer superconducting printed circuit boards
|f S. V. Uchaykin
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| 203 |
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|a Text
|c electronic
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| 300 |
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|a Title screen
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|a A superconducting printed circuit board, comprising a first electrically insulative substrate layer having a first surface and a second surface opposed to the first surface, at least a second electrically insulative substrate layer having a first surface and a second surface opposed to the first surface, the second electrically insulative substrate layer physically coupled to the first electrically insulative substrate layer, a first superconducting current path positioned on a first surface side of the first electrically insulative substrate layer, a second superconducting current path positioned between the first and second electrically insulative layer, and a third superconducting current path that extends through the first electrically insulative substrate layer and superconducting couples the first superconducting current path with the second superconducting current path.
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|a труды учёных ТПУ
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|a электронный ресурс
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| 610 |
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|a патенты
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| 700 |
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|a Uchaykin
|b S. V.
|c specialist in the field of non-destructive testing
|c Engineer of Tomsk Polytechnic University, Doctor of physical and mathematical sciences
|f 1963-
|g Sergey Victorovich
|2 stltpush
|3 (RuTPU)RU\TPU\pers\32279
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|a D-Wave Systems Inc.
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|c 20170306
|g RCR
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|u https://worldwide.espacenet.com/publicationDetails/biblio?DB=EPODOC&II=0&ND=3&adjacent=true&locale=ru_ru&FT=D&date=20090416&CC=WO&NR=2009046546A1&KC=A1#
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| 942 |
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|c CF
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