Systems, methods, and apparatus for combined superconducting magnetic shielding and radiation shielding
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| 要約: | Title screen A device is at least partially contained within a shielded enclosure formed by a first material that has a high thermal conductivity and plated with a second material that is superconductive below a critical temperature. An exterior of the shielded enclosure is at least partially wound by a compensation coil that is coupled to a current source. One or more measurement devices are responsive to magnetic fields in close proximity to the device, allowing compensation by controlling current to the compensation coil. Thus, magnetic shielding may be provided by compensation fields that may be trapped within the shielded enclosure when the system is cooled below the critical temperature of the second material. Radiation shielding may be provided by cooling the shielded enclosure to a temperature that is approximately equal to the temperature of the device. |
| 言語: | 英語 |
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| オンライン･アクセス: | http://patentscope.wipo.int/search/en/detail.jsf?docId=WO2009055930&recNum=55&docAn=CA2008001926&queryString=ALL:(%2522quantum%2520entanglement%2522)&maxRec=181 |
| フォーマット: | 電子媒体 図書 |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637187 |
| 要約: | Title screen A device is at least partially contained within a shielded enclosure formed by a first material that has a high thermal conductivity and plated with a second material that is superconductive below a critical temperature. An exterior of the shielded enclosure is at least partially wound by a compensation coil that is coupled to a current source. One or more measurement devices are responsive to magnetic fields in close proximity to the device, allowing compensation by controlling current to the compensation coil. Thus, magnetic shielding may be provided by compensation fields that may be trapped within the shielded enclosure when the system is cooled below the critical temperature of the second material. Radiation shielding may be provided by cooling the shielded enclosure to a temperature that is approximately equal to the temperature of the device. |
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