Systems, methods, and apparatus for cryogenic refrigeration

Bibliographic Details
Corporate Author: D-Wave Systems Inc.
Other Authors: Black R. C. Randall C., Hilton J. P. Jeremy P., Rose G. Geordie, Petroff J. C. Jacob Craig, Uchaykin S. V. Sergey Victorovich
Summary:Title screen
Cryogenic refrigeration employs a pulse tube cryo-cooler and a dilution refrigerator to provide very low temperature cooling, for example, to cool superconducting processors. Continuous cryogenic cycle refrigeration may be achieved using multiple adsorption pumps. Various improvements may include multiple distinct thermal-linking points, evaporation pots with cooling structures, and/or one or more gas-gap heat switches which may be integral to an adsorption pump. A reservoir volume may provide pressure relief when the system is warmed above cryogenic temperature, reducing the mass of the system. Additional heat exchangers and/or separate paths for condensation and evaporation may be provided. Multi-channel connectors may be used, and/or connectors formed of a regenerative material with a high specific heat capacity at cryogenic temperature. Flexible PCBs may provide thermal links to components that embody temperature gradients. Various components may be pre-cooled, for example via a switchable thermalization system
Language:English
Published:
Subjects:
Online Access:http://appft1.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PG01&s1=20100281885.PGNR.&OS=DN/20100281885&RS=DN/20100281885
Format: xMaterials Electronic Book
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637135

MARC

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330 |a Cryogenic refrigeration employs a pulse tube cryo-cooler and a dilution refrigerator to provide very low temperature cooling, for example, to cool superconducting processors. Continuous cryogenic cycle refrigeration may be achieved using multiple adsorption pumps. Various improvements may include multiple distinct thermal-linking points, evaporation pots with cooling structures, and/or one or more gas-gap heat switches which may be integral to an adsorption pump. A reservoir volume may provide pressure relief when the system is warmed above cryogenic temperature, reducing the mass of the system. Additional heat exchangers and/or separate paths for condensation and evaporation may be provided. Multi-channel connectors may be used, and/or connectors formed of a regenerative material with a high specific heat capacity at cryogenic temperature. Flexible PCBs may provide thermal links to components that embody temperature gradients. Various components may be pre-cooled, for example via a switchable thermalization system 
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701 1 |a Hilton  |b J. P.  |g Jeremy P. 
701 1 |a Rose  |b G.  |g Geordie 
701 1 |a Petroff  |b J. C.  |g Jacob Craig 
701 1 |a Uchaykin  |b S. V.  |c specialist in the field of non-destructive testing  |c Engineer of Tomsk Polytechnic University, Doctor of physical and mathematical sciences  |f 1963-  |g Sergey Victorovich  |2 stltpush  |3 (RuTPU)RU\TPU\pers\32279 
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