The research of copper coatings properties obtained by plasmodynamic method

The research of copper coatings properties obtained by plasmodynamic method

Λεπτομέρειες βιβλιογραφικής εγγραφής
Parent link:	Известия вузов. Физика: научный журнал.— , 1957- Т. 55, № 12-3.— 2012.— [С. 138-141]
Κύριος συγγραφέας:	Sivkov A. A. Aleksander Anatolyevich
Συγγραφή απο Οργανισμό/Αρχή:	Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП)
Άλλοι συγγραφείς:	Saigash A. S. Anastasiya Sergeevna, Kolganova J. L. Julia Leonidovna
Περίληψη:	Заглавие с экрана The experimental research results about the conditions influence of copper depositing at the aluminum contact surface by a plasmodynamic method to the value of a copper-aluminum contact pair resistivity are shown in this paper. It's shown a significant decrease of the contact resistivity (to 1.1 mΩ-mm 2) 2.5 times compared with an ordinary copper and aluminum connection, by optimizing the phase composition, the transition layer structure and its transition layer microhardness increase Режим доступа: по договору с организацией-держателем ресурса
Γλώσσα:	Αγγλικά
Έκδοση:	2012
Θέματα:	электронный ресурс труды учёных ТПУ
Διαθέσιμο Online:	http://elibrary.ru/item.asp?id=20710407
Μορφή:	Ηλεκτρονική πηγή Κεφάλαιο βιβλίου
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637039

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