Three-dimensional analysis of transient thermal NDT problems by data simulation and processing; Thermosense XXII, Orlando, April 24, 2000

Three-dimensional analysis of transient thermal NDT problems by data simulation and processing; Thermosense XXII, Orlando, April 24, 2000

Detalles Bibliográficos
Parent link:	Thermosense XXII, Orlando, April 24, 2000.— 2000.— [P. 152-163]
Autor Principal:	Vavilov V. P. Vladimir Platonovich
Summary:	Title screen he paper is devoted to the analysis of 2D and 3D numerical models, including such features as defect shape, overlapped and neighbor defects, uneven heating, spatial resolution of thermal NDT and the transition criteria for 1D-2D (3D) models Режим доступа: по договору с организацией-держателем ресурса
Idioma:	inglés
Publicado:	2000
Subjects:	электронный ресурс труды учёных ТПУ тепловой неразрушающий контроль thermal testing теплопроводность thermal conductivity численные модели numerical models
Acceso en liña:	http://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=901866
Formato:	Electrónico Capítulo de libro
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637004

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