Three-dimensional analysis of transient thermal NDT problems by data simulation and processing; Thermosense XXII, Orlando, April 24, 2000

Three-dimensional analysis of transient thermal NDT problems by data simulation and processing; Thermosense XXII, Orlando, April 24, 2000

Dades bibliogràfiques
Parent link:	Thermosense XXII, Orlando, April 24, 2000.— 2000.— [P. 152-163]
Autor principal:	Vavilov V. P. Vladimir Platonovich
Sumari:	Title screen he paper is devoted to the analysis of 2D and 3D numerical models, including such features as defect shape, overlapped and neighbor defects, uneven heating, spatial resolution of thermal NDT and the transition criteria for 1D-2D (3D) models Режим доступа: по договору с организацией-держателем ресурса
Idioma:	anglès
Publicat:	2000
Matèries:	электронный ресурс труды учёных ТПУ тепловой неразрушающий контроль thermal testing теплопроводность thermal conductivity численные модели numerical models
Accés en línia:	http://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=901866
Format:	Electrònic Capítol de llibre
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637004

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