Three-dimensional analysis of transient thermal NDT problems by data simulation and processing; Thermosense XXII, Orlando, April 24, 2000

Three-dimensional analysis of transient thermal NDT problems by data simulation and processing; Thermosense XXII, Orlando, April 24, 2000

Detaylı Bibliyografya
Parent link:	Thermosense XXII, Orlando, April 24, 2000.— 2000.— [P. 152-163]
Yazar:	Vavilov V. P. Vladimir Platonovich
Özet:	Title screen he paper is devoted to the analysis of 2D and 3D numerical models, including such features as defect shape, overlapped and neighbor defects, uneven heating, spatial resolution of thermal NDT and the transition criteria for 1D-2D (3D) models Режим доступа: по договору с организацией-держателем ресурса
Dil:	İngilizce
Baskı/Yayın Bilgisi:	2000
Konular:	электронный ресурс труды учёных ТПУ тепловой неразрушающий контроль thermal testing теплопроводность thermal conductivity численные модели numerical models
Online Erişim:	http://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=901866
Materyal Türü:	Elektronik Kitap Bölümü
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=637004

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