Reducing the value of transient contact resistance due to deposition of copper coatings on aluminum samples by plasmodynamic method; German-Russian Forum Nanotechnology
| Parent link: | German-Russian Forum Nanotechnology.— 2013.— [P. 47] |
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| Autore principale: | |
| Ente Autore: | |
| Altri autori: | , |
| Riassunto: | Title screen. |
| Lingua: | inglese |
| Pubblicazione: |
2013
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| Soggetti: | |
| Accesso online: | http://www.lib.tpu.ru/fulltext/c/2013/C100/003.pdf |
| Natura: | Elettronico Capitolo di libro |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=613653 |