Reducing the value of transient contact resistance due to deposition of copper coatings on aluminum samples by plasmodynamic method
| Parent link: | German-Russian Forum Nanotechnology: programme and abstracts, May, 21-24, 2013, Tomsk, Russia/ National Research Tomsk Polytechnic University (TPU). [P. 47].— , 2013 |
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| मुख्य लेखक: | |
| निगमित लेखक: | |
| अन्य लेखक: | , |
| सारांश: | Title screen. |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
2013
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| विषय: | |
| ऑनलाइन पहुंच: | http://www.lib.tpu.ru/fulltext/c/2013/C100/003.pdf |
| स्वरूप: | इलेक्ट्रोनिक पुस्तक अध्याय |
| KOHA link: | https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=613653 |