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Reducing the value of transient contact resistance due to deposition of copper coatings on aluminum samples by plasmodynamic method; German-Russian Forum Nanotechnology

Reducing the value of transient contact resistance due to deposition of copper coatings on aluminum samples by plasmodynamic method; German-Russian Forum Nanotechnology

Manylion Llyfryddiaeth
Parent link:German-Russian Forum Nanotechnology.— 2013.— [P. 47]
Prif Awdur: Sivkov A. A. Aleksandr Anatolyevich
Awdur Corfforaethol: Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП)
Awduron Eraill: Saigash A. S. Anastasiya Sergeevna, Kolganova J. L. Julia Leonidovna
Crynodeb:Title screen.
Iaith:Saesneg
Cyhoeddwyd: 2013
Pynciau:
труды учёных ТПУ
электронный ресурс
Mynediad Ar-lein:http://www.lib.tpu.ru/fulltext/c/2013/C100/003.pdf
Fformat: Electronig Pennod Llyfr
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=613653
  • Daliadau
  • Disgrifiad
  • Eitemau Tebyg
  • Dangos Staff

Rhyngrwyd

http://www.lib.tpu.ru/fulltext/c/2013/C100/003.pdf

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