Reducing the value of transient contact resistance due to deposition of copper coatings on aluminum samples by plasmodynamic method

Reducing the value of transient contact resistance due to deposition of copper coatings on aluminum samples by plasmodynamic method

Xehetasun bibliografikoak
Parent link:	German-Russian Forum Nanotechnology: programme and abstracts, May, 21-24, 2013, Tomsk, Russia/ National Research Tomsk Polytechnic University (TPU). [P. 47].— , 2013
Egile nagusia:	Sivkov A. A. Aleksandr Anatolyevich
Erakunde egilea:	Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП)
Beste egile batzuk:	Saigash A. S. Anastasiya Sergeevna, Kolganova J. L. Julia Leonidovna
Gaia:	Title screen.
Hizkuntza:	ingelesa
Argitaratua:	2013
Gaiak:	труды учёных ТПУ электронный ресурс
Sarrera elektronikoa:	http://www.lib.tpu.ru/fulltext/c/2013/C100/003.pdf
Formatua:	Baliabide elektronikoa Liburu kapitulua
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=613653

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