Reducing the value of transient contact resistance due to deposition of copper coatings on aluminum samples by plasmodynamic method; German-Russian Forum Nanotechnology

Reducing the value of transient contact resistance due to deposition of copper coatings on aluminum samples by plasmodynamic method; German-Russian Forum Nanotechnology

Bibliographic Details
Parent link:	German-Russian Forum Nanotechnology.— 2013.— [P. 47]
Main Author:	Sivkov A. A. Aleksandr Anatolyevich
Corporate Author:	Национальный исследовательский Томский политехнический университет (ТПУ) Энергетический институт (ЭНИН) Кафедра электроснабжения промышленных предприятий (ЭПП)
Other Authors:	Saigash A. S. Anastasiya Sergeevna, Kolganova J. L. Julia Leonidovna
Summary:	Title screen.
Language:	English
Published:	2013
Subjects:	труды учёных ТПУ электронный ресурс
Online Access:	http://www.lib.tpu.ru/fulltext/c/2013/C100/003.pdf
Format:	Electronic Book Chapter
KOHA link:	https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=613653

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