Sivkov A. A. Aleksandr Anatolyevich, Saigash A. S. Anastasiya Sergeevna, & Kolganova J. L. Julia Leonidovna. (2013). Reducing the value of transient contact resistance due to deposition of copper coatings on aluminum samples by plasmodynamic method. 2013.
Chicago-Zitierstil (17. Ausg.)Sivkov A. A. Aleksandr Anatolyevich, Saigash A. S. Anastasiya Sergeevna, und Kolganova J. L. Julia Leonidovna. Reducing the Value of Transient Contact Resistance Due to Deposition of Copper Coatings on Aluminum Samples by Plasmodynamic Method. 2013, 2013.
MLA-Zitierstil (9. Ausg.)Sivkov A. A. Aleksandr Anatolyevich, et al. Reducing the Value of Transient Contact Resistance Due to Deposition of Copper Coatings on Aluminum Samples by Plasmodynamic Method. 2013, 2013.
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