APA (7th ed.) Citation

Sivkov A. A. Aleksandr Anatolyevich, Saigash A. S. Anastasiya Sergeevna, & Kolganova J. L. Julia Leonidovna. (2013). Reducing the value of transient contact resistance due to deposition of copper coatings on aluminum samples by plasmodynamic method; German-Russian Forum Nanotechnology. 2013.

Chicago Style (17th ed.) Citation

Sivkov A. A. Aleksandr Anatolyevich, Saigash A. S. Anastasiya Sergeevna, and Kolganova J. L. Julia Leonidovna. Reducing the Value of Transient Contact Resistance Due to Deposition of Copper Coatings on Aluminum Samples by Plasmodynamic Method; German-Russian Forum Nanotechnology. 2013, 2013.

MLA (9th ed.) Citation

Sivkov A. A. Aleksandr Anatolyevich, et al. Reducing the Value of Transient Contact Resistance Due to Deposition of Copper Coatings on Aluminum Samples by Plasmodynamic Method; German-Russian Forum Nanotechnology. 2013, 2013.