Особенности состава и структуры современных LTCC материалов; Перспективы развития фундаментальных наук

Bibliographic Details
Parent link:Перспективы развития фундаментальных наук.— 2015.— [С. 484-486]
Main Author: Пашков Д. А. Дмитрий Александрович
Corporate Author: Национальный исследовательский Томский политехнический университет (ТПУ) Институт физики высоких технологий (ИФВТ) Кафедра технологии силикатов и наноматериалов (ТСН)
Other Authors: Тютюнькова Д. О. (научный руководитель), Погребенков В. М. Валерий Матвеевич
Summary:Заглавие с экрана
Many domestic electronics manufacturers use foreign LTCC materials in the absence of the Russian counterpart. Identification of the composition and structure of the materials is the first step in the development of LTCC material. Ceramic materials of DuPont and Ferro companies were researched in this work. The microstructure, consist and physical properties of the co-firing process were identified by the X-ray and microscope analysis. The components of foreign LTCC materials were identified as glass and corundum compositions with average particle size of 1-3 microns.
Language:Russian
Published: 2015
Series:Химия
Subjects:
Online Access:http://earchive.tpu.ru/handle/11683/19185
http://www.lib.tpu.ru/fulltext/c/2015/C21/151.pdf
Format: Electronic Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=613028
Description
Physical Description:1 файл(414 Кб)
Summary:Заглавие с экрана
Many domestic electronics manufacturers use foreign LTCC materials in the absence of the Russian counterpart. Identification of the composition and structure of the materials is the first step in the development of LTCC material. Ceramic materials of DuPont and Ferro companies were researched in this work. The microstructure, consist and physical properties of the co-firing process were identified by the X-ray and microscope analysis. The components of foreign LTCC materials were identified as glass and corundum compositions with average particle size of 1-3 microns.