Vacuum arc deposition of TIN and TIOx films on large metallic and dielectric surfaces; Proceedings of the 17th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV, Berkeley, CA, july 21-26, 1996; Vol. 2

Vacuum arc deposition of TIN and TIOx films on large metallic and dielectric surfaces; Proceedings of the 17th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV, Berkeley, CA, july 21-26, 1996; Vol. 2

Bibliografiska uppgifter
Parent link:Proceedings of the 17th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV, Berkeley, CA, july 21-26, 1996.— , 1996
Vol. 2.— 1996.— P. 881-883
Övriga upphovsmän: Borisov D. P., Koval N. N. Nikolay Nikolaevich, Kovsharov N. F., Tolkachev V. S., Schanin P. M.
Sammanfattning:Plasma-assisted vacuum deposition of TiN and TiOx films is performed using four vacuum arc evaporators and four hot-cathode-arc plasma generators. Film deposition on substrates of total area 6 m2 , with the workpiece having dimensions of 1?1.6 m, is completed in one cycle. The arc parameters in the process of film deposition are typically as follows: the vacuum arc current and voltage are 100 A and 30 V, respectively, and the hot-cathode arc current and voltage are 20 A and 50 V, respectively. The deposition of a TiN film on a metal takes 50 min, while the TiN or TiOx film deposition on a dielectric occurs within 20 min.
В фонде НТБ ТПУ отсутствует
Språk:engelska
Publicerad: 1996
Ämnen:
труды учёных ТПУ
Materialtyp: Bokavsnitt
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=602548

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