Investigations of electrical resistivity of cu-films, produced by vacuum-arc evaporation on dielectric substrates

Investigations of electrical resistivity of cu-films, produced by vacuum-arc evaporation on dielectric substrates

Bibliographic Details
Parent link:10th International Conference on Modification of Materials with Particle Beams and Plasma Flows, Tomsk, 19-24 September 2010: proceedings/ Tomsk Polytechnic University (TPU) ; Institute of High Current Electronics SB RAS ; High voltage research institute Tomsk Polytechnic University ; Nuclear Physics institute Tomsk Polytechnic University ; International Conference on Modification of Materials with Particle Beams and Plasma Flows ; ed. N. Koval and A. I. Ryabchikov. P. 576-578.— , 2010.— 978-5-94458-112-9
Other Authors: Samoilenko (Samoylenko) G. M. Gennady Mikhailovich, Yushkov Y. G. Yuri Georgievich, Chumerin P.Yu., Ryabchikov A. I. Aleksandr Ilyich, Stepanov I. B. Igor Borisovich, Shulepov I. A. Ivan Anisimovich
Summary:The results of the preliminary investigations of physical-mechanical and impedance characteristicsof copper coverings on a dielectric substrates, received by a vacuum-arc evaporationmethod with short-pulse high-frequency potential of displacement are presented. Engineering andmodes of deposition, measurements of physicalmechanical properties and surface films impedancein a range of frequencies 1.5-9.4 GHz are described. Copper coverings by thickness 2-5 μm onquartz, glass and Teflon with surface resistance equal to surface resistance of a bulk copper in themicrowave range are received
Published: 2010
Subjects:
труды учёных ТПУ
Format: Book Chapter
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=239676

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