Copper Coating of Aluminium Contact Surfaces Using Magnetoplasma Accelerator; 13 International symposium on high current electronics

Copper Coating of Aluminium Contact Surfaces Using Magnetoplasma Accelerator; 13 International symposium on high current electronics

Bibliografiset tiedot
Parent link:13 International symposium on high current electronics.— 2004.— [P. 457-459]
Muut tekijät: Sivkov А. А., Gerasimov D. Y., Tsibina А. S., Abramochkin V. N.
Yhteenveto:Title from the title-page.
The urgency of a task of drawing of a copper covering on aluminium surfaces is proved. The opportunity of use for this purpose pulse magneto-plasma of the accelerator with high-current by the category such as Z-pinch is shown. In atmospheric conditions the copper coverings by thickness ~ 100 microns on aluminium samples are received, high adhesion which is caused by formation of a boundary layer of mutual hashing at influence hipersound of a flow of copper plasma on an aluminium surface. The opportunity of the decision of a problem of overlapping high-current of contact pair Cu-Al and significant reduction of its transitive contact resistance is experimentally shown at use of a copper covering put on an aluminium surface with the help magneto-plasma of the accelerator.
Режим доступа: из корпоративной сети ТПУ
Text files
Kieli:englanti
Julkaistu: 2004
Sarja:Pulsed power applications
Aiheet:
физика
плазма
магнитоплазменные ускорители
алюминий
поверхности
медные покрытия
Z-пинчи
импульсы
труды учёных ТПУ
электронный ресурс
Linkit:http://www.lib.tpu.ru/fulltext2/c/2004/C13/028.pdf
Aineistotyyppi: Elektroninen Kirjan osa
KOHA link:https://koha.lib.tpu.ru/cgi-bin/koha/opac-detail.pl?biblionumber=231822

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